JP7798237B2 - 樹脂多層基板及び回路モジュール - Google Patents

樹脂多層基板及び回路モジュール

Info

Publication number
JP7798237B2
JP7798237B2 JP2025515178A JP2025515178A JP7798237B2 JP 7798237 B2 JP7798237 B2 JP 7798237B2 JP 2025515178 A JP2025515178 A JP 2025515178A JP 2025515178 A JP2025515178 A JP 2025515178A JP 7798237 B2 JP7798237 B2 JP 7798237B2
Authority
JP
Japan
Prior art keywords
conductor layer
resin
corners
conductor
multilayer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025515178A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024219286A1 (https=
JPWO2024219286A5 (https=
Inventor
幸也 平岡
良知 田中
和裕 山地
知大 古村
克郎 平山
直樹 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024219286A1 publication Critical patent/JPWO2024219286A1/ja
Publication of JPWO2024219286A5 publication Critical patent/JPWO2024219286A5/ja
Application granted granted Critical
Publication of JP7798237B2 publication Critical patent/JP7798237B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09863—Concave hole or via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2025515178A 2023-04-20 2024-04-09 樹脂多層基板及び回路モジュール Active JP7798237B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023069293 2023-04-20
JP2023069293 2023-04-20
PCT/JP2024/014345 WO2024219286A1 (ja) 2023-04-20 2024-04-09 樹脂多層基板及び回路モジュール

Publications (3)

Publication Number Publication Date
JPWO2024219286A1 JPWO2024219286A1 (https=) 2024-10-24
JPWO2024219286A5 JPWO2024219286A5 (https=) 2025-11-04
JP7798237B2 true JP7798237B2 (ja) 2026-01-14

Family

ID=93152370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025515178A Active JP7798237B2 (ja) 2023-04-20 2024-04-09 樹脂多層基板及び回路モジュール

Country Status (5)

Country Link
US (1) US20260032818A1 (https=)
JP (1) JP7798237B2 (https=)
CN (1) CN120982217A (https=)
DE (1) DE112024001581T5 (https=)
WO (1) WO2024219286A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085098A (ja) 2006-09-28 2008-04-10 Kyocera Corp 配線基板および電子装置
JP2015119073A (ja) 2013-12-19 2015-06-25 日本シイエムケイ株式会社 多層プリント配線板および、その製造方法
WO2018079198A1 (ja) 2016-10-28 2018-05-03 株式会社村田製作所 樹脂回路基板
JP2019080039A (ja) 2017-10-20 2019-05-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
JP2019080034A (ja) 2017-10-20 2019-05-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
WO2022202322A1 (ja) 2021-03-26 2022-09-29 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法
JP2022150717A (ja) 2021-03-26 2022-10-07 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085098A (ja) 2006-09-28 2008-04-10 Kyocera Corp 配線基板および電子装置
JP2015119073A (ja) 2013-12-19 2015-06-25 日本シイエムケイ株式会社 多層プリント配線板および、その製造方法
WO2018079198A1 (ja) 2016-10-28 2018-05-03 株式会社村田製作所 樹脂回路基板
JP2019080039A (ja) 2017-10-20 2019-05-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
JP2019080034A (ja) 2017-10-20 2019-05-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
WO2022202322A1 (ja) 2021-03-26 2022-09-29 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法
JP2022150717A (ja) 2021-03-26 2022-10-07 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法

Also Published As

Publication number Publication date
WO2024219286A1 (ja) 2024-10-24
JPWO2024219286A1 (https=) 2024-10-24
CN120982217A (zh) 2025-11-18
US20260032818A1 (en) 2026-01-29
DE112024001581T5 (de) 2026-01-29

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