JPWO2024195725A5 - - Google Patents
Info
- Publication number
- JPWO2024195725A5 JPWO2024195725A5 JP2025508395A JP2025508395A JPWO2024195725A5 JP WO2024195725 A5 JPWO2024195725 A5 JP WO2024195725A5 JP 2025508395 A JP2025508395 A JP 2025508395A JP 2025508395 A JP2025508395 A JP 2025508395A JP WO2024195725 A5 JPWO2024195725 A5 JP WO2024195725A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor
- semiconductor device
- semiconductor layers
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023042942 | 2023-03-17 | ||
| PCT/JP2024/010258 WO2024195725A1 (ja) | 2023-03-17 | 2024-03-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024195725A1 JPWO2024195725A1 (https=) | 2024-09-26 |
| JPWO2024195725A5 true JPWO2024195725A5 (https=) | 2026-02-13 |
Family
ID=92841693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025508395A Pending JPWO2024195725A1 (https=) | 2023-03-17 | 2024-03-15 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4682958A1 (https=) |
| JP (1) | JPWO2024195725A1 (https=) |
| KR (1) | KR20250163920A (https=) |
| CN (1) | CN120660462A (https=) |
| TW (1) | TW202504081A (https=) |
| WO (1) | WO2024195725A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001036054A (ja) * | 1999-07-19 | 2001-02-09 | Mitsubishi Electric Corp | Ｓｏｉ基板の製造方法 |
| JPWO2017038403A1 (ja) * | 2015-09-01 | 2018-08-16 | ソニー株式会社 | 積層体 |
| TWI905469B (zh) | 2017-10-30 | 2025-11-21 | 日商索尼半導體解決方案公司 | 固體攝像裝置及電子機器 |
| JP2022077181A (ja) * | 2020-11-11 | 2022-05-23 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| JP2022089275A (ja) * | 2020-12-04 | 2022-06-16 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、電子機器、製造方法 |
| JP7556505B2 (ja) * | 2020-12-25 | 2024-09-26 | 国立大学法人東京工業大学 | 半導体装置及びその製造方法 |
| CN117652029A (zh) * | 2021-07-27 | 2024-03-05 | 索尼半导体解决方案公司 | 固体摄像元件、摄像装置和电子设备 |
| JP7798514B2 (ja) | 2021-09-15 | 2026-01-14 | 高砂熱学工業株式会社 | データセンターの空調システム |
-
2024
- 2024-03-15 TW TW113109822A patent/TW202504081A/zh unknown
- 2024-03-15 WO PCT/JP2024/010258 patent/WO2024195725A1/ja not_active Ceased
- 2024-03-15 JP JP2025508395A patent/JPWO2024195725A1/ja active Pending
- 2024-03-15 EP EP24774861.9A patent/EP4682958A1/en active Pending
- 2024-03-15 KR KR1020257033697A patent/KR20250163920A/ko active Pending
- 2024-03-15 CN CN202480011036.1A patent/CN120660462A/zh active Pending
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