JPWO2024190344A5 - - Google Patents

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Publication number
JPWO2024190344A5
JPWO2024190344A5 JP2025506643A JP2025506643A JPWO2024190344A5 JP WO2024190344 A5 JPWO2024190344 A5 JP WO2024190344A5 JP 2025506643 A JP2025506643 A JP 2025506643A JP 2025506643 A JP2025506643 A JP 2025506643A JP WO2024190344 A5 JPWO2024190344 A5 JP WO2024190344A5
Authority
JP
Japan
Prior art keywords
well
semiconductor device
semiconductor layer
total area
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506643A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024190344A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/006344 external-priority patent/WO2024190344A1/ja
Publication of JPWO2024190344A1 publication Critical patent/JPWO2024190344A1/ja
Publication of JPWO2024190344A5 publication Critical patent/JPWO2024190344A5/ja
Pending legal-status Critical Current

Links

JP2025506643A 2023-03-16 2024-02-21 Pending JPWO2024190344A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023042200 2023-03-16
PCT/JP2024/006344 WO2024190344A1 (ja) 2023-03-16 2024-02-21 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024190344A1 JPWO2024190344A1 (https=) 2024-09-19
JPWO2024190344A5 true JPWO2024190344A5 (https=) 2025-12-02

Family

ID=92755408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506643A Pending JPWO2024190344A1 (https=) 2023-03-16 2024-02-21

Country Status (4)

Country Link
US (1) US20260013160A1 (https=)
JP (1) JPWO2024190344A1 (https=)
CN (1) CN120814351A (https=)
WO (1) WO2024190344A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3618517B2 (ja) * 1997-06-18 2005-02-09 三菱電機株式会社 半導体装置およびその製造方法
JP5207666B2 (ja) * 2007-06-11 2013-06-12 ローム株式会社 半導体装置
CN105210187B (zh) * 2013-10-04 2017-10-10 富士电机株式会社 半导体装置
JP7585646B2 (ja) * 2019-08-13 2024-11-19 富士電機株式会社 半導体装置および半導体装置の製造方法
WO2021246361A1 (ja) * 2020-06-05 2021-12-09 ローム株式会社 半導体装置

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