JPWO2024181147A5 - - Google Patents

Info

Publication number
JPWO2024181147A5
JPWO2024181147A5 JP2025503762A JP2025503762A JPWO2024181147A5 JP WO2024181147 A5 JPWO2024181147 A5 JP WO2024181147A5 JP 2025503762 A JP2025503762 A JP 2025503762A JP 2025503762 A JP2025503762 A JP 2025503762A JP WO2024181147 A5 JPWO2024181147 A5 JP WO2024181147A5
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
thickness direction
protected
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025503762A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024181147A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/005257 external-priority patent/WO2024181147A1/ja
Publication of JPWO2024181147A1 publication Critical patent/JPWO2024181147A1/ja
Publication of JPWO2024181147A5 publication Critical patent/JPWO2024181147A5/ja
Pending legal-status Critical Current

Links

JP2025503762A 2023-03-02 2024-02-15 Pending JPWO2024181147A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023031686 2023-03-02
PCT/JP2024/005257 WO2024181147A1 (ja) 2023-03-02 2024-02-15 半導体装置および車両

Publications (2)

Publication Number Publication Date
JPWO2024181147A1 JPWO2024181147A1 (https=) 2024-09-06
JPWO2024181147A5 true JPWO2024181147A5 (https=) 2025-11-14

Family

ID=92589761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025503762A Pending JPWO2024181147A1 (https=) 2023-03-02 2024-02-15

Country Status (2)

Country Link
JP (1) JPWO2024181147A1 (https=)
WO (1) WO2024181147A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115428143A (zh) * 2020-04-27 2022-12-02 罗姆股份有限公司 半导体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5228519B2 (ja) * 2008-02-19 2013-07-03 富士電機株式会社 半導体装置
WO2013111276A1 (ja) * 2012-01-25 2013-08-01 三菱電機株式会社 電力用半導体装置
JP2014150203A (ja) * 2013-02-04 2014-08-21 Mitsubishi Electric Corp パワーモジュール、およびパワーモジュールの製造方法
JP6507715B2 (ja) * 2015-02-26 2019-05-08 株式会社デンソー モールドパッケージの製造方法
JP7439521B2 (ja) * 2020-01-10 2024-02-28 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
DE112021002452T5 (de) * 2020-10-14 2023-02-09 Rohm Co., Ltd. Halbleitermodul

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