JPWO2024181147A1 - - Google Patents
Info
- Publication number
- JPWO2024181147A1 JPWO2024181147A1 JP2025503762A JP2025503762A JPWO2024181147A1 JP WO2024181147 A1 JPWO2024181147 A1 JP WO2024181147A1 JP 2025503762 A JP2025503762 A JP 2025503762A JP 2025503762 A JP2025503762 A JP 2025503762A JP WO2024181147 A1 JPWO2024181147 A1 JP WO2024181147A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023031686 | 2023-03-02 | ||
| PCT/JP2024/005257 WO2024181147A1 (ja) | 2023-03-02 | 2024-02-15 | 半導体装置および車両 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024181147A1 true JPWO2024181147A1 (https=) | 2024-09-06 |
| JPWO2024181147A5 JPWO2024181147A5 (https=) | 2025-11-14 |
Family
ID=92589761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025503762A Pending JPWO2024181147A1 (https=) | 2023-03-02 | 2024-02-15 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024181147A1 (https=) |
| WO (1) | WO2024181147A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115428143A (zh) * | 2020-04-27 | 2022-12-02 | 罗姆股份有限公司 | 半导体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5228519B2 (ja) * | 2008-02-19 | 2013-07-03 | 富士電機株式会社 | 半導体装置 |
| WO2013111276A1 (ja) * | 2012-01-25 | 2013-08-01 | 三菱電機株式会社 | 電力用半導体装置 |
| JP2014150203A (ja) * | 2013-02-04 | 2014-08-21 | Mitsubishi Electric Corp | パワーモジュール、およびパワーモジュールの製造方法 |
| JP6507715B2 (ja) * | 2015-02-26 | 2019-05-08 | 株式会社デンソー | モールドパッケージの製造方法 |
| JP7439521B2 (ja) * | 2020-01-10 | 2024-02-28 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| DE112021002452T5 (de) * | 2020-10-14 | 2023-02-09 | Rohm Co., Ltd. | Halbleitermodul |
-
2024
- 2024-02-15 WO PCT/JP2024/005257 patent/WO2024181147A1/ja not_active Ceased
- 2024-02-15 JP JP2025503762A patent/JPWO2024181147A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024181147A1 (ja) | 2024-09-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250827 |