JPWO2024177013A5 - - Google Patents

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Publication number
JPWO2024177013A5
JPWO2024177013A5 JP2024542211A JP2024542211A JPWO2024177013A5 JP WO2024177013 A5 JPWO2024177013 A5 JP WO2024177013A5 JP 2024542211 A JP2024542211 A JP 2024542211A JP 2024542211 A JP2024542211 A JP 2024542211A JP WO2024177013 A5 JPWO2024177013 A5 JP WO2024177013A5
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor package
substrate
groove
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024542211A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024177013A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/005799 external-priority patent/WO2024177013A1/ja
Publication of JPWO2024177013A1 publication Critical patent/JPWO2024177013A1/ja
Publication of JPWO2024177013A5 publication Critical patent/JPWO2024177013A5/ja
Pending legal-status Critical Current

Links

JP2024542211A 2023-02-20 2024-02-19 Pending JPWO2024177013A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023024048 2023-02-20
PCT/JP2024/005799 WO2024177013A1 (ja) 2023-02-20 2024-02-19 半導体パッケージ、及びモジュール

Publications (2)

Publication Number Publication Date
JPWO2024177013A1 JPWO2024177013A1 (https=) 2024-08-29
JPWO2024177013A5 true JPWO2024177013A5 (https=) 2025-01-29

Family

ID=92501123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024542211A Pending JPWO2024177013A1 (https=) 2023-02-20 2024-02-19

Country Status (2)

Country Link
JP (1) JPWO2024177013A1 (https=)
WO (1) WO2024177013A1 (https=)

Family Cites Families (35)

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JPS62101265U (https=) * 1985-12-17 1987-06-27
JPH01174956U (https=) * 1988-05-30 1989-12-13
JPH04364793A (ja) * 1991-06-12 1992-12-17 Fujitsu Ten Ltd 電子部品の実装構造
JPH05226803A (ja) * 1992-02-10 1993-09-03 Matsushita Electric Works Ltd 実装回路基板
JPH0633083U (ja) * 1992-10-05 1994-04-28 株式会社トーキン 電流検出器
JPH0846091A (ja) * 1994-07-27 1996-02-16 Hitachi Ltd ボールグリッドアレイ半導体装置
JPH08233865A (ja) * 1995-02-28 1996-09-13 Victor Co Of Japan Ltd 電流検知ユニット
JPH09307969A (ja) * 1996-05-16 1997-11-28 Matsushita Electric Ind Co Ltd 自動検針装置
JPH1084128A (ja) * 1996-09-06 1998-03-31 Yokogawa Electric Corp フォトカプラ
JPH10308490A (ja) * 1997-05-02 1998-11-17 Shindengen Electric Mfg Co Ltd 半導体デバイス
JP2000277870A (ja) * 1999-03-24 2000-10-06 Murata Mach Ltd 印刷回路基板
JP4025958B2 (ja) * 2000-05-17 2007-12-26 サンケン電気株式会社 ホ−ル素子を備えた電流検出装置
JP2002329815A (ja) * 2001-05-01 2002-11-15 Sony Corp 半導体装置と、その製造方法、及びその製造装置
JP2004077184A (ja) * 2002-08-12 2004-03-11 Furukawa Electric Co Ltd:The 電流検出センサ
JP2004228113A (ja) * 2003-01-20 2004-08-12 Rion Co Ltd プリント基板を用いた絶縁構造
JP2007171156A (ja) * 2005-11-22 2007-07-05 Asahi Kasei Corp 電流検出素子及びその製造方法
CH698504B1 (de) * 2006-05-16 2009-08-31 Melexis Technologies Sa Vorrichtung zur Strommessung.
JP5401292B2 (ja) * 2009-12-15 2014-01-29 ルネサスエレクトロニクス株式会社 半導体装置及び通信方法
US8878073B2 (en) * 2012-06-18 2014-11-04 Regal Beloit America, Inc. Printed circuit board and methods of manufacturing the same
JP5695196B2 (ja) * 2011-07-13 2015-04-01 旭化成エレクトロニクス株式会社 電流センサ用基板及び電流センサ
DE102011079050A1 (de) * 2011-07-13 2013-01-17 Robert Bosch Gmbh Verfahren zum Bestücken einer Leiterplatte
JP5906910B2 (ja) * 2012-04-09 2016-04-20 株式会社デンソー 電子装置
JP5879595B2 (ja) * 2012-05-18 2016-03-08 アルプス・グリーンデバイス株式会社 電流センサ
JP2014154732A (ja) * 2013-02-08 2014-08-25 Toshiba Corp 電子機器および半導体電子部品
JP6099135B2 (ja) * 2013-03-27 2017-03-22 日本電気通信システム株式会社 電子機器、実装基板、及び実装基板の製造方法
CN106461705B (zh) * 2014-06-27 2019-04-30 旭化成微电子株式会社 电流传感器
CA2995090A1 (en) * 2015-08-07 2017-02-16 Vishay Dale Electronics, Llc Molded body and electrical device having a molded body for high voltage applications
JP2019087636A (ja) * 2017-11-07 2019-06-06 富士電機株式会社 半導体パッケージ
JP2020092160A (ja) * 2018-12-05 2020-06-11 日本電産株式会社 モータ
JP2021082794A (ja) * 2019-11-22 2021-05-27 株式会社デンソー 電子部品および電子装置
JP7527916B2 (ja) * 2020-09-29 2024-08-05 ローム株式会社 半導体装置
US11519946B1 (en) * 2021-08-23 2022-12-06 Allegro Microsystems, Llc Packaged current sensor integrated circuit

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