JPWO2024176357A5 - - Google Patents

Info

Publication number
JPWO2024176357A5
JPWO2024176357A5 JP2025501983A JP2025501983A JPWO2024176357A5 JP WO2024176357 A5 JPWO2024176357 A5 JP WO2024176357A5 JP 2025501983 A JP2025501983 A JP 2025501983A JP 2025501983 A JP2025501983 A JP 2025501983A JP WO2024176357 A5 JPWO2024176357 A5 JP WO2024176357A5
Authority
JP
Japan
Prior art keywords
solder material
weight
less
alloy phase
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025501983A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024176357A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/006253 external-priority patent/WO2024176357A1/ja
Publication of JPWO2024176357A1 publication Critical patent/JPWO2024176357A1/ja
Publication of JPWO2024176357A5 publication Critical patent/JPWO2024176357A5/ja
Pending legal-status Critical Current

Links

JP2025501983A 2023-02-21 2023-02-21 Pending JPWO2024176357A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/006253 WO2024176357A1 (ja) 2023-02-21 2023-02-21 はんだ材、はんだシートの製造方法および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024176357A1 JPWO2024176357A1 (https=) 2024-08-29
JPWO2024176357A5 true JPWO2024176357A5 (https=) 2025-07-15

Family

ID=92500382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025501983A Pending JPWO2024176357A1 (https=) 2023-02-21 2023-02-21

Country Status (4)

Country Link
JP (1) JPWO2024176357A1 (https=)
CN (1) CN120712154A (https=)
DE (1) DE112023005851T5 (https=)
WO (1) WO2024176357A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08273987A (ja) * 1995-03-31 1996-10-18 Nitsuko Corp アルミ固体コンデンサ
JP3736452B2 (ja) * 2000-12-21 2006-01-18 株式会社日立製作所 はんだ箔
JP2007275921A (ja) * 2006-04-05 2007-10-25 Mitsubishi Electric Corp はんだ合金およびはんだ付方法
JP5652001B2 (ja) * 2010-05-31 2015-01-14 住友金属鉱山株式会社 Ｚｎを主成分とするＰｂフリーはんだ合金
DK2883649T3 (da) * 2012-08-10 2017-06-19 Senju Metal Industry Co Blyfri højtemperatur-loddelegering
JP6654613B2 (ja) * 2016-12-22 2020-02-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法

Similar Documents

Publication Publication Date Title
JP2006100775A5 (https=)
CN101641176B (zh) 高温焊接材料
TW201210733A (en) Variable melting point solders
CA2467583A1 (en) Fluxless brazing method and compositions of layered material systems for brazing aluminum or dissimilar metals
JP6603728B2 (ja) プレート熱交換器を製造する方法
CN104001719A (zh) 一种钛轧制复合板的制造方法
WO2018042890A1 (ja) 接合体およびこれを用いた半導体装置
JP2013116473A (ja) ヒートシンクの製造方法およびヒートシンク
JPWO2024176357A5 (https=)
CN107052613A (zh) 低熔点无铅焊料及其制备方法
JP5937214B2 (ja) 金属接合用はんだ合金及びこれを用いたはんだ付け方法
Zhao et al. Abnormal intermetallic compound evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni micro solder joints under thermomigration
JP2017174853A (ja) 保持装置の製造方法
US10111342B2 (en) Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet
CN110666267A (zh) 一种锡焊点合金化形成方法
JP6881971B2 (ja) ろう材、ろう材金属粉末、及び部材の接合方法
JP2007150355A5 (https=)
CN110072665B (zh) 钎焊材料
TWI640741B (zh) 鈦板式熱交換器及其生產方法
CN109304527A (zh) 一种空气电阻炉炉中钎焊的工艺
US1813657A (en) Method of and apparatus for soldering
CN103031472A (zh) 一种空分设备用钎焊板及其制备方法
CN108856943B (zh) 一种TiAl和氮化硅的钎焊方法
JPH04270092A (ja) 半田材料及び接合方法
JPS61273253A (ja) 熱交換器の伝熱部及びその製造法