CN120712154A - 焊料、焊料片的制造方法及半导体装置的制造方法 - Google Patents

焊料、焊料片的制造方法及半导体装置的制造方法

Info

Publication number
CN120712154A
CN120712154A CN202380093613.1A CN202380093613A CN120712154A CN 120712154 A CN120712154 A CN 120712154A CN 202380093613 A CN202380093613 A CN 202380093613A CN 120712154 A CN120712154 A CN 120712154A
Authority
CN
China
Prior art keywords
solder
sheet
less
alloy phase
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380093613.1A
Other languages
English (en)
Chinese (zh)
Inventor
山崎浩次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120712154A publication Critical patent/CN120712154A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
CN202380093613.1A 2023-02-21 2023-02-21 焊料、焊料片的制造方法及半导体装置的制造方法 Pending CN120712154A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/006253 WO2024176357A1 (ja) 2023-02-21 2023-02-21 はんだ材、はんだシートの製造方法および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN120712154A true CN120712154A (zh) 2025-09-26

Family

ID=92500382

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380093613.1A Pending CN120712154A (zh) 2023-02-21 2023-02-21 焊料、焊料片的制造方法及半导体装置的制造方法

Country Status (4)

Country Link
JP (1) JPWO2024176357A1 (https=)
CN (1) CN120712154A (https=)
DE (1) DE112023005851T5 (https=)
WO (1) WO2024176357A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08273987A (ja) * 1995-03-31 1996-10-18 Nitsuko Corp アルミ固体コンデンサ
JP3736452B2 (ja) * 2000-12-21 2006-01-18 株式会社日立製作所 はんだ箔
JP2007275921A (ja) * 2006-04-05 2007-10-25 Mitsubishi Electric Corp はんだ合金およびはんだ付方法
JP5652001B2 (ja) * 2010-05-31 2015-01-14 住友金属鉱山株式会社 Ｚｎを主成分とするＰｂフリーはんだ合金
DK2883649T3 (da) * 2012-08-10 2017-06-19 Senju Metal Industry Co Blyfri højtemperatur-loddelegering
JP6654613B2 (ja) * 2016-12-22 2020-02-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法

Also Published As

Publication number Publication date
DE112023005851T5 (de) 2025-12-04
WO2024176357A1 (ja) 2024-08-29
JPWO2024176357A1 (https=) 2024-08-29

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