JPWO2024172068A5 - - Google Patents

Info

Publication number
JPWO2024172068A5
JPWO2024172068A5 JP2025501176A JP2025501176A JPWO2024172068A5 JP WO2024172068 A5 JPWO2024172068 A5 JP WO2024172068A5 JP 2025501176 A JP2025501176 A JP 2025501176A JP 2025501176 A JP2025501176 A JP 2025501176A JP WO2024172068 A5 JPWO2024172068 A5 JP WO2024172068A5
Authority
JP
Japan
Prior art keywords
main surface
connection portion
wiring board
conductor
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025501176A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024172068A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/004997 external-priority patent/WO2024172068A1/ja
Publication of JPWO2024172068A1 publication Critical patent/JPWO2024172068A1/ja
Publication of JPWO2024172068A5 publication Critical patent/JPWO2024172068A5/ja
Pending legal-status Critical Current

Links

JP2025501176A 2023-02-17 2024-02-14 Pending JPWO2024172068A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023023686 2023-02-17
PCT/JP2024/004997 WO2024172068A1 (ja) 2023-02-17 2024-02-14 配線基板

Publications (2)

Publication Number Publication Date
JPWO2024172068A1 JPWO2024172068A1 (https=) 2024-08-22
JPWO2024172068A5 true JPWO2024172068A5 (https=) 2025-10-24

Family

ID=92419940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025501176A Pending JPWO2024172068A1 (https=) 2023-02-17 2024-02-14

Country Status (2)

Country Link
JP (1) JPWO2024172068A1 (https=)
WO (1) WO2024172068A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250651A (ja) * 1995-03-10 1996-09-27 Nippon Steel Corp 半導体パッケージ
JP3834426B2 (ja) * 1997-09-02 2006-10-18 沖電気工業株式会社 半導体装置
JP4454145B2 (ja) * 2000-12-27 2010-04-21 京セラ株式会社 電子部品収納用セラミックパッケージ及び電子部品装置
JP2015096882A (ja) * 2013-11-15 2015-05-21 セイコーエプソン株式会社 電気光学装置および投射型表示装置

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