JPWO2024172068A1 - - Google Patents
Info
- Publication number
- JPWO2024172068A1 JPWO2024172068A1 JP2025501176A JP2025501176A JPWO2024172068A1 JP WO2024172068 A1 JPWO2024172068 A1 JP WO2024172068A1 JP 2025501176 A JP2025501176 A JP 2025501176A JP 2025501176 A JP2025501176 A JP 2025501176A JP WO2024172068 A1 JPWO2024172068 A1 JP WO2024172068A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023023686 | 2023-02-17 | ||
| PCT/JP2024/004997 WO2024172068A1 (ja) | 2023-02-17 | 2024-02-14 | 配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024172068A1 true JPWO2024172068A1 (https=) | 2024-08-22 |
| JPWO2024172068A5 JPWO2024172068A5 (https=) | 2025-10-24 |
Family
ID=92419940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025501176A Pending JPWO2024172068A1 (https=) | 2023-02-17 | 2024-02-14 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024172068A1 (https=) |
| WO (1) | WO2024172068A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08250651A (ja) * | 1995-03-10 | 1996-09-27 | Nippon Steel Corp | 半導体パッケージ |
| JP3834426B2 (ja) * | 1997-09-02 | 2006-10-18 | 沖電気工業株式会社 | 半導体装置 |
| JP4454145B2 (ja) * | 2000-12-27 | 2010-04-21 | 京セラ株式会社 | 電子部品収納用セラミックパッケージ及び電子部品装置 |
| JP2015096882A (ja) * | 2013-11-15 | 2015-05-21 | セイコーエプソン株式会社 | 電気光学装置および投射型表示装置 |
-
2024
- 2024-02-14 WO PCT/JP2024/004997 patent/WO2024172068A1/ja not_active Ceased
- 2024-02-14 JP JP2025501176A patent/JPWO2024172068A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024172068A1 (ja) | 2024-08-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250812 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250812 |