JPWO2024171509A5 - - Google Patents

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Publication number
JPWO2024171509A5
JPWO2024171509A5 JP2024509096A JP2024509096A JPWO2024171509A5 JP WO2024171509 A5 JPWO2024171509 A5 JP WO2024171509A5 JP 2024509096 A JP2024509096 A JP 2024509096A JP 2024509096 A JP2024509096 A JP 2024509096A JP WO2024171509 A5 JPWO2024171509 A5 JP WO2024171509A5
Authority
JP
Japan
Prior art keywords
forming portion
capacitance forming
main surface
dielectric film
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024509096A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024171509A1 (https=
JP7571916B1 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/036362 external-priority patent/WO2024171509A1/ja
Publication of JPWO2024171509A1 publication Critical patent/JPWO2024171509A1/ja
Application granted granted Critical
Publication of JP7571916B1 publication Critical patent/JP7571916B1/ja
Publication of JPWO2024171509A5 publication Critical patent/JPWO2024171509A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024509096A 2023-02-13 2023-10-05 コンデンサ Active JP7571916B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023020175 2023-02-13
JP2023020175 2023-02-13
PCT/JP2023/036362 WO2024171509A1 (ja) 2023-02-13 2023-10-05 コンデンサ

Publications (3)

Publication Number Publication Date
JPWO2024171509A1 JPWO2024171509A1 (https=) 2024-08-22
JP7571916B1 JP7571916B1 (ja) 2024-10-23
JPWO2024171509A5 true JPWO2024171509A5 (https=) 2025-01-22

Family

ID=92421033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024509096A Active JP7571916B1 (ja) 2023-02-13 2023-10-05 コンデンサ

Country Status (4)

Country Link
US (1) US20250308789A1 (https=)
JP (1) JP7571916B1 (https=)
CN (1) CN120500733A (https=)
WO (1) WO2024171509A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2655632B2 (ja) * 1993-07-27 1997-09-24 日本電気株式会社 チップ型固体電解コンデンサ
JP2000031387A (ja) * 1998-07-14 2000-01-28 Fuji Electric Co Ltd 誘電体薄膜コンデンサの製造方法
JP2004128333A (ja) * 2002-10-04 2004-04-22 Shinko Electric Ind Co Ltd 薄膜コンデンサ装置、その実装モジュール及び製造方法
JP4647194B2 (ja) * 2003-07-14 2011-03-09 新光電気工業株式会社 キャパシタ装置及びその製造方法
JP2008130722A (ja) * 2006-11-20 2008-06-05 Matsushita Electric Ind Co Ltd 固体電解コンデンサ内蔵回路基板とその製造方法
JP5105479B2 (ja) * 2008-02-13 2012-12-26 Ｎｅｃトーキン株式会社 固体電解コンデンサ
JP2011103424A (ja) * 2009-11-12 2011-05-26 Rohm Co Ltd 固体電解コンデンサおよび固体電解コンデンサの製造方法
JP6579502B2 (ja) * 2017-07-26 2019-09-25 株式会社村田製作所 キャパシタ
JP7180561B2 (ja) * 2019-03-29 2022-11-30 株式会社村田製作所 コンデンサアレイ、及び、複合電子部品
WO2021193616A1 (ja) * 2020-03-24 2021-09-30 株式会社村田製作所 コンデンサ
TW202348104A (zh) * 2020-09-01 2023-12-01 日商村田製作所股份有限公司 半導體複合裝置及半導體複合裝置之製造方法
JP7597249B2 (ja) * 2022-01-31 2024-12-10 株式会社村田製作所 コンデンサ

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