JPWO2024075596A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2024075596A5 JPWO2024075596A5 JP2024555743A JP2024555743A JPWO2024075596A5 JP WO2024075596 A5 JPWO2024075596 A5 JP WO2024075596A5 JP 2024555743 A JP2024555743 A JP 2024555743A JP 2024555743 A JP2024555743 A JP 2024555743A JP WO2024075596 A5 JPWO2024075596 A5 JP WO2024075596A5
- Authority
- JP
- Japan
- Prior art keywords
- period
- high frequency
- frequency power
- periods
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003252 repetitive effect Effects 0.000 claims 23
- 239000000758 substrate Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 4
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024227718A JP2025041838A (ja) | 2022-10-07 | 2024-12-24 | プラズマ処理装置、電源システム、及び周波数制御方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022162643 | 2022-10-07 | ||
| JP2022162643 | 2022-10-07 | ||
| JP2022178137 | 2022-11-07 | ||
| JP2022178137 | 2022-11-07 | ||
| PCT/JP2023/034969 WO2024075596A1 (ja) | 2022-10-07 | 2023-09-26 | プラズマ処理装置、電源システム、及び周波数制御方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024227718A Division JP2025041838A (ja) | 2022-10-07 | 2024-12-24 | プラズマ処理装置、電源システム、及び周波数制御方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024075596A1 JPWO2024075596A1 (https=) | 2024-04-11 |
| JPWO2024075596A5 true JPWO2024075596A5 (https=) | 2024-12-17 |
| JP7612949B2 JP7612949B2 (ja) | 2025-01-14 |
Family
ID=90608317
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024555743A Active JP7612949B2 (ja) | 2022-10-07 | 2023-09-26 | プラズマ処理装置、電源システム、及び周波数制御方法 |
| JP2024227718A Pending JP2025041838A (ja) | 2022-10-07 | 2024-12-24 | プラズマ処理装置、電源システム、及び周波数制御方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024227718A Pending JP2025041838A (ja) | 2022-10-07 | 2024-12-24 | プラズマ処理装置、電源システム、及び周波数制御方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250132129A1 (https=) |
| JP (2) | JP7612949B2 (https=) |
| KR (2) | KR20260006694A (https=) |
| CN (1) | CN119923954A (https=) |
| WO (1) | WO2024075596A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026053764A1 (ja) * | 2024-09-05 | 2026-03-12 | 東京エレクトロン株式会社 | プラズマ処理装置、電源システム、及びプラズマ処理方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5319150B2 (ja) | 2008-03-31 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法及びコンピュータ読み取り可能な記憶媒体 |
| US12230475B2 (en) * | 2018-08-14 | 2025-02-18 | Tokyo Electron Limited | Systems and methods of control for plasma processing |
| US11315757B2 (en) * | 2019-08-13 | 2022-04-26 | Mks Instruments, Inc. | Method and apparatus to enhance sheath formation, evolution and pulse to pulse stability in RF powered plasma applications |
-
2023
- 2023-09-26 KR KR1020257042468A patent/KR20260006694A/ko active Pending
- 2023-09-26 KR KR1020247042040A patent/KR102905047B1/ko active Active
- 2023-09-26 CN CN202380049744.XA patent/CN119923954A/zh active Pending
- 2023-09-26 WO PCT/JP2023/034969 patent/WO2024075596A1/ja not_active Ceased
- 2023-09-26 JP JP2024555743A patent/JP7612949B2/ja active Active
-
2024
- 2024-12-24 JP JP2024227718A patent/JP2025041838A/ja active Pending
- 2024-12-24 US US19/000,700 patent/US20250132129A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9376745B2 (en) | High-power sputtering source | |
| TWI720009B (zh) | 具有約鋸齒波脈衝的rf功率傳輸 | |
| JP2019220650A5 (https=) | ||
| JP2022020007A5 (https=) | ||
| KR100397137B1 (ko) | 이온 도금 장치 및 이온 도금 방법 | |
| JP5395491B2 (ja) | 基板処理装置及び基板処理方法 | |
| KR102382267B1 (ko) | 연속파 플라즈마와 펄싱 플라즈마 사이의 전이를 제어하기 위한 방법들 및 장치들 | |
| JP2020004710A5 (https=) | ||
| JP2020505722A5 (https=) | ||
| TW200612488A (en) | Plasma processing apparatus, method thereof, and computer readable memory medium | |
| KR101764767B1 (ko) | 플라즈마 처리 방법 및 플라즈마 처리 장치 | |
| JPWO2024075596A5 (https=) | ||
| WO2004107394A3 (ja) | プラズマ処理装置、プラズマ生成用の反応器の製造方法、及びプラズマ処理方法 | |
| CN108028165A (zh) | 用于处理基板的射频功率传输调节 | |
| JP2018517263A5 (ja) | イオン注入システム及びその場(in situ)プラズマクリーニング方法 | |
| KR20230144653A (ko) | 고 종횡비 에칭을 위한 플라즈마 에칭 툴 | |
| KR20100058346A (ko) | 동기식 펄스 플라즈마 에칭 장비 | |
| WO2014064779A1 (ja) | プラズマ処理装置及び方法 | |
| JP2024074894A5 (ja) | プラズマ処理装置 | |
| JP5701958B2 (ja) | 基板処理装置 | |
| MY197365A (en) | Apparatus and method for the plasma treatment of wafers | |
| JP5170216B2 (ja) | プラズマ発生装置 | |
| JP2022103235A5 (ja) | 電源システム | |
| CN111916327A (zh) | 多频率多阶段的等离子体射频输出的方法及其装置 | |
| JP2020061534A5 (https=) |