JPWO2024004985A5 - - Google Patents

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Publication number
JPWO2024004985A5
JPWO2024004985A5 JP2024530856A JP2024530856A JPWO2024004985A5 JP WO2024004985 A5 JPWO2024004985 A5 JP WO2024004985A5 JP 2024530856 A JP2024530856 A JP 2024530856A JP 2024530856 A JP2024530856 A JP 2024530856A JP WO2024004985 A5 JPWO2024004985 A5 JP WO2024004985A5
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JP
Japan
Prior art keywords
substrate
planar
conductors
electronic component
component according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024530856A
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English (en)
Japanese (ja)
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JPWO2024004985A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/023730 external-priority patent/WO2024004985A1/ja
Publication of JPWO2024004985A1 publication Critical patent/JPWO2024004985A1/ja
Publication of JPWO2024004985A5 publication Critical patent/JPWO2024004985A5/ja
Pending legal-status Critical Current

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JP2024530856A 2022-06-30 2023-06-27 Pending JPWO2024004985A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022105968 2022-06-30
PCT/JP2023/023730 WO2024004985A1 (ja) 2022-06-30 2023-06-27 電子部品

Publications (2)

Publication Number Publication Date
JPWO2024004985A1 JPWO2024004985A1 (https=) 2024-01-04
JPWO2024004985A5 true JPWO2024004985A5 (https=) 2025-02-14

Family

ID=89383083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024530856A Pending JPWO2024004985A1 (https=) 2022-06-30 2023-06-27

Country Status (4)

Country Link
US (1) US20250118659A1 (https=)
JP (1) JPWO2024004985A1 (https=)
CN (1) CN119384882A (https=)
WO (1) WO2024004985A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
JP2001223334A (ja) * 2000-02-09 2001-08-17 Toshiba Corp 半導体装置製造方法および半導体装置
JP2004103756A (ja) * 2002-09-09 2004-04-02 Tdk Corp コイル部品およびその製造方法
CN101460964B (zh) * 2006-06-01 2011-09-21 株式会社村田制作所 无线ic器件和无线ic器件用复合元件
US9954267B2 (en) * 2015-12-28 2018-04-24 Qualcomm Incorporated Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
WO2017210814A1 (zh) * 2016-06-06 2017-12-14 华为技术有限公司 互感耦合滤波器及无线保真WiFi模组
JP2021197454A (ja) * 2020-06-15 2021-12-27 イビデン株式会社 配線基板及び配線基板の製造方法
WO2022097492A1 (ja) * 2020-11-06 2022-05-12 株式会社村田製作所 フィルタ装置およびそれを搭載した高周波フロントエンド回路

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