JPWO2024004985A1 - - Google Patents
Info
- Publication number
- JPWO2024004985A1 JPWO2024004985A1 JP2024530856A JP2024530856A JPWO2024004985A1 JP WO2024004985 A1 JPWO2024004985 A1 JP WO2024004985A1 JP 2024530856 A JP2024530856 A JP 2024530856A JP 2024530856 A JP2024530856 A JP 2024530856A JP WO2024004985 A1 JPWO2024004985 A1 JP WO2024004985A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/497—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/495—Capacitive arrangements or effects of, or between wiring layers
- H10W20/496—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/498—Resistive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/20—Inductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/62—Capacitors having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022105968 | 2022-06-30 | ||
| PCT/JP2023/023730 WO2024004985A1 (ja) | 2022-06-30 | 2023-06-27 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024004985A1 true JPWO2024004985A1 (https=) | 2024-01-04 |
| JPWO2024004985A5 JPWO2024004985A5 (https=) | 2025-02-14 |
Family
ID=89383083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024530856A Pending JPWO2024004985A1 (https=) | 2022-06-30 | 2023-06-27 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250118659A1 (https=) |
| JP (1) | JPWO2024004985A1 (https=) |
| CN (1) | CN119384882A (https=) |
| WO (1) | WO2024004985A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| JP2001223334A (ja) * | 2000-02-09 | 2001-08-17 | Toshiba Corp | 半導体装置製造方法および半導体装置 |
| JP2004103756A (ja) * | 2002-09-09 | 2004-04-02 | Tdk Corp | コイル部品およびその製造方法 |
| WO2007138857A1 (ja) * | 2006-06-01 | 2007-12-06 | Murata Manufacturing Co., Ltd. | 無線ｉｃデバイス及び無線ｉｃデバイス用複合部品 |
| JP2019507972A (ja) * | 2015-12-28 | 2019-03-22 | クアルコム，インコーポレイテッド | ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成 |
| JP2019525683A (ja) * | 2016-06-06 | 2019-09-05 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | 誘導結合フィルタ及びワイヤレス・フィデリティＷｉＦｉモジュール |
| JP2021197454A (ja) * | 2020-06-15 | 2021-12-27 | イビデン株式会社 | 配線基板及び配線基板の製造方法 |
| WO2022097492A1 (ja) * | 2020-11-06 | 2022-05-12 | 株式会社村田製作所 | フィルタ装置およびそれを搭載した高周波フロントエンド回路 |
-
2023
- 2023-06-27 JP JP2024530856A patent/JPWO2024004985A1/ja active Pending
- 2023-06-27 WO PCT/JP2023/023730 patent/WO2024004985A1/ja not_active Ceased
- 2023-06-27 CN CN202380046805.7A patent/CN119384882A/zh active Pending
-
2024
- 2024-12-19 US US18/987,891 patent/US20250118659A1/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5070317A (en) * | 1989-01-17 | 1991-12-03 | Bhagat Jayant K | Miniature inductor for integrated circuits and devices |
| JP2001223334A (ja) * | 2000-02-09 | 2001-08-17 | Toshiba Corp | 半導体装置製造方法および半導体装置 |
| JP2004103756A (ja) * | 2002-09-09 | 2004-04-02 | Tdk Corp | コイル部品およびその製造方法 |
| WO2007138857A1 (ja) * | 2006-06-01 | 2007-12-06 | Murata Manufacturing Co., Ltd. | 無線ｉｃデバイス及び無線ｉｃデバイス用複合部品 |
| JP2019507972A (ja) * | 2015-12-28 | 2019-03-22 | クアルコム，インコーポレイテッド | ３ｄガラス貫通ビアフィルタと統合された２ｄ受動オンガラスフィルタを使用するマルチプレクサ構成 |
| JP2019525683A (ja) * | 2016-06-06 | 2019-09-05 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | 誘導結合フィルタ及びワイヤレス・フィデリティＷｉＦｉモジュール |
| JP2021197454A (ja) * | 2020-06-15 | 2021-12-27 | イビデン株式会社 | 配線基板及び配線基板の製造方法 |
| WO2022097492A1 (ja) * | 2020-11-06 | 2022-05-12 | 株式会社村田製作所 | フィルタ装置およびそれを搭載した高周波フロントエンド回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024004985A1 (ja) | 2024-01-04 |
| CN119384882A (zh) | 2025-01-28 |
| US20250118659A1 (en) | 2025-04-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241202 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260210 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260413 |