JPWO2023223126A5 - - Google Patents
Info
- Publication number
- JPWO2023223126A5 JPWO2023223126A5 JP2024521382A JP2024521382A JPWO2023223126A5 JP WO2023223126 A5 JPWO2023223126 A5 JP WO2023223126A5 JP 2024521382 A JP2024521382 A JP 2024521382A JP 2024521382 A JP2024521382 A JP 2024521382A JP WO2023223126 A5 JPWO2023223126 A5 JP WO2023223126A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- semiconductor device
- circuit
- electrode
- voltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022079907 | 2022-05-16 | ||
| PCT/IB2023/054508 WO2023223126A1 (ja) | 2022-05-16 | 2023-05-01 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023223126A1 JPWO2023223126A1 (https=) | 2023-11-23 |
| JPWO2023223126A5 true JPWO2023223126A5 (https=) | 2026-03-25 |
Family
ID=88834747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521382A Pending JPWO2023223126A1 (https=) | 2022-05-16 | 2023-05-01 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250287612A1 (https=) |
| JP (1) | JPWO2023223126A1 (https=) |
| KR (1) | KR20250010031A (https=) |
| CN (1) | CN119234309A (https=) |
| WO (1) | WO2023223126A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9391453B2 (en) * | 2013-06-26 | 2016-07-12 | Intel Corporation | Power management in multi-die assemblies |
| WO2020157553A1 (ja) * | 2019-01-29 | 2020-08-06 | 株式会社半導体エネルギー研究所 | 記憶装置 |
| JP2020123612A (ja) * | 2019-01-29 | 2020-08-13 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法、半導体装置の製造装置 |
| US11804479B2 (en) * | 2019-09-27 | 2023-10-31 | Advanced Micro Devices, Inc. | Scheme for enabling die reuse in 3D stacked products |
| WO2021090106A1 (ja) * | 2019-11-08 | 2021-05-14 | 株式会社半導体エネルギー研究所 | トランジスタ、および電子機器 |
-
2023
- 2023-05-01 JP JP2024521382A patent/JPWO2023223126A1/ja active Pending
- 2023-05-01 US US18/862,984 patent/US20250287612A1/en active Pending
- 2023-05-01 CN CN202380040260.9A patent/CN119234309A/zh active Pending
- 2023-05-01 KR KR1020247040776A patent/KR20250010031A/ko active Pending
- 2023-05-01 WO PCT/IB2023/054508 patent/WO2023223126A1/ja not_active Ceased
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