JPWO2023190575A5 - - Google Patents
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- Publication number
- JPWO2023190575A5 JPWO2023190575A5 JP2023548296A JP2023548296A JPWO2023190575A5 JP WO2023190575 A5 JPWO2023190575 A5 JP WO2023190575A5 JP 2023548296 A JP2023548296 A JP 2023548296A JP 2023548296 A JP2023548296 A JP 2023548296A JP WO2023190575 A5 JPWO2023190575 A5 JP WO2023190575A5
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- semi
- metal pattern
- circuit board
- composite sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 26
- 239000002184 metal Substances 0.000 claims 26
- 239000000919 ceramic Substances 0.000 claims 20
- 239000002131 composite material Substances 0.000 claims 19
- 239000000805 composite resin Substances 0.000 claims 13
- 238000000034 method Methods 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 238000005520 cutting process Methods 0.000 claims 4
- 239000011888 foil Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 229910052582 BN Inorganic materials 0.000 claims 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- 238000010008 shearing Methods 0.000 claims 2
- 238000007665 sagging Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024033575A JP2024055999A (ja) | 2022-03-30 | 2024-03-06 | 回路基板の製造方法及び回路基板 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022055083 | 2022-03-30 | ||
| JP2022055083 | 2022-03-30 | ||
| PCT/JP2023/012636 WO2023190575A1 (ja) | 2022-03-30 | 2023-03-28 | 回路基板の製造方法及び回路基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024033575A Division JP2024055999A (ja) | 2022-03-30 | 2024-03-06 | 回路基板の製造方法及び回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023190575A1 JPWO2023190575A1 (https=) | 2023-10-05 |
| JPWO2023190575A5 true JPWO2023190575A5 (https=) | 2024-03-08 |
| JP7451827B2 JP7451827B2 (ja) | 2024-03-18 |
Family
ID=88201854
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548296A Active JP7451827B2 (ja) | 2022-03-30 | 2023-03-28 | 回路基板の製造方法及び回路基板 |
| JP2024033575A Pending JP2024055999A (ja) | 2022-03-30 | 2024-03-06 | 回路基板の製造方法及び回路基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024033575A Pending JP2024055999A (ja) | 2022-03-30 | 2024-03-06 | 回路基板の製造方法及び回路基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP7451827B2 (https=) |
| WO (1) | WO2023190575A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203313A (ja) * | 1999-11-09 | 2001-07-27 | Matsushita Electric Ind Co Ltd | 熱伝導基板およびその製造方法 |
| JP2006077172A (ja) * | 2004-09-10 | 2006-03-23 | Sumitomo Bakelite Co Ltd | 絶縁性樹脂組成物、その製造方法及び電子部品 |
| JP4842177B2 (ja) * | 2007-03-07 | 2011-12-21 | 三菱電機株式会社 | 回路基板及びパワーモジュール |
| US20130193452A1 (en) * | 2012-01-31 | 2013-08-01 | E.I. Du Pont De Nemours And Company | Light emitting diode system and methods relating thereto |
| JP2015093075A (ja) * | 2013-11-12 | 2015-05-18 | 日本碍子株式会社 | 熱調理器具 |
| JP2017085077A (ja) * | 2015-10-27 | 2017-05-18 | Ｊｘ金属株式会社 | 回路基板用金属板成形品および、パワーモジュールの製造方法 |
| JPWO2018043682A1 (ja) * | 2016-09-01 | 2019-06-24 | Ａｇｃ株式会社 | 配線基板およびその製造方法 |
| JP6879834B2 (ja) * | 2017-06-21 | 2021-06-02 | 日本発條株式会社 | 回路基板およびその製造方法 |
| JP7374613B2 (ja) * | 2019-05-21 | 2023-11-07 | 日本発條株式会社 | 樹脂モールド回路体、金型、製造方法、及び回路基板 |
| WO2021200965A1 (ja) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | 複合体シート |
-
2023
- 2023-03-28 JP JP2023548296A patent/JP7451827B2/ja active Active
- 2023-03-28 WO PCT/JP2023/012636 patent/WO2023190575A1/ja not_active Ceased
-
2024
- 2024-03-06 JP JP2024033575A patent/JP2024055999A/ja active Pending
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