JPWO2023190575A1 - - Google Patents

Info

Publication number
JPWO2023190575A1
JPWO2023190575A1 JP2023548296A JP2023548296A JPWO2023190575A1 JP WO2023190575 A1 JPWO2023190575 A1 JP WO2023190575A1 JP 2023548296 A JP2023548296 A JP 2023548296A JP 2023548296 A JP2023548296 A JP 2023548296A JP WO2023190575 A1 JPWO2023190575 A1 JP WO2023190575A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023548296A
Other languages
Japanese (ja)
Other versions
JP7451827B2 (ja
JPWO2023190575A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023190575A1 publication Critical patent/JPWO2023190575A1/ja
Priority to JP2024033575A priority Critical patent/JP2024055999A/ja
Publication of JPWO2023190575A5 publication Critical patent/JPWO2023190575A5/ja
Application granted granted Critical
Publication of JP7451827B2 publication Critical patent/JP7451827B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
JP2023548296A 2022-03-30 2023-03-28 回路基板の製造方法及び回路基板 Active JP7451827B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024033575A JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022055083 2022-03-30
JP2022055083 2022-03-30
PCT/JP2023/012636 WO2023190575A1 (ja) 2022-03-30 2023-03-28 回路基板の製造方法及び回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024033575A Division JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Publications (3)

Publication Number Publication Date
JPWO2023190575A1 true JPWO2023190575A1 (https=) 2023-10-05
JPWO2023190575A5 JPWO2023190575A5 (https=) 2024-03-08
JP7451827B2 JP7451827B2 (ja) 2024-03-18

Family

ID=88201854

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023548296A Active JP7451827B2 (ja) 2022-03-30 2023-03-28 回路基板の製造方法及び回路基板
JP2024033575A Pending JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024033575A Pending JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Country Status (2)

Country Link
JP (2) JP7451827B2 (https=)
WO (1) WO2023190575A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203313A (ja) * 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2008218907A (ja) * 2007-03-07 2008-09-18 Mitsubishi Electric Corp 回路基板及びパワーモジュール
JP2017085077A (ja) * 2015-10-27 2017-05-18 Ｊｘ金属株式会社 回路基板用金属板成形品および、パワーモジュールの製造方法
JP2020191372A (ja) * 2019-05-21 2020-11-26 日本発條株式会社 樹脂モールド回路体、金型、製造方法、及び回路基板
JP2021132216A (ja) * 2017-06-21 2021-09-09 日本発條株式会社 回路基板の製造方法
WO2021200965A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 複合体シート

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006077172A (ja) * 2004-09-10 2006-03-23 Sumitomo Bakelite Co Ltd 絶縁性樹脂組成物、その製造方法及び電子部品
US20130193452A1 (en) * 2012-01-31 2013-08-01 E.I. Du Pont De Nemours And Company Light emitting diode system and methods relating thereto
JP2015093075A (ja) * 2013-11-12 2015-05-18 日本碍子株式会社 熱調理器具
JPWO2018043682A1 (ja) * 2016-09-01 2019-06-24 Ａｇｃ株式会社 配線基板およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203313A (ja) * 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2008218907A (ja) * 2007-03-07 2008-09-18 Mitsubishi Electric Corp 回路基板及びパワーモジュール
JP2017085077A (ja) * 2015-10-27 2017-05-18 Ｊｘ金属株式会社 回路基板用金属板成形品および、パワーモジュールの製造方法
JP2021132216A (ja) * 2017-06-21 2021-09-09 日本発條株式会社 回路基板の製造方法
JP2020191372A (ja) * 2019-05-21 2020-11-26 日本発條株式会社 樹脂モールド回路体、金型、製造方法、及び回路基板
WO2021200965A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 複合体シート

Also Published As

Publication number Publication date
JP7451827B2 (ja) 2024-03-18
WO2023190575A1 (ja) 2023-10-05
JP2024055999A (ja) 2024-04-19

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