JP7451827B2 - 回路基板の製造方法及び回路基板 - Google Patents

回路基板の製造方法及び回路基板 Download PDF

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Publication number
JP7451827B2
JP7451827B2 JP2023548296A JP2023548296A JP7451827B2 JP 7451827 B2 JP7451827 B2 JP 7451827B2 JP 2023548296 A JP2023548296 A JP 2023548296A JP 2023548296 A JP2023548296 A JP 2023548296A JP 7451827 B2 JP7451827 B2 JP 7451827B2
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Japan
Prior art keywords
semi
composite sheet
ceramic
cured
metal pattern
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Active
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JP2023548296A
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English (en)
Japanese (ja)
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JPWO2023190575A1 (https=
JPWO2023190575A5 (https=
Inventor
建治 宮田
翔二 岩切
紗緒梨 井之上
良太 熊谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Denka Co Ltd, Denki Kagaku Kogyo KK filed Critical Denka Co Ltd
Publication of JPWO2023190575A1 publication Critical patent/JPWO2023190575A1/ja
Priority to JP2024033575A priority Critical patent/JP2024055999A/ja
Publication of JPWO2023190575A5 publication Critical patent/JPWO2023190575A5/ja
Application granted granted Critical
Publication of JP7451827B2 publication Critical patent/JP7451827B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
JP2023548296A 2022-03-30 2023-03-28 回路基板の製造方法及び回路基板 Active JP7451827B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024033575A JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022055083 2022-03-30
JP2022055083 2022-03-30
PCT/JP2023/012636 WO2023190575A1 (ja) 2022-03-30 2023-03-28 回路基板の製造方法及び回路基板

Related Child Applications (1)

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JP2024033575A Division JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Publications (3)

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JPWO2023190575A1 JPWO2023190575A1 (https=) 2023-10-05
JPWO2023190575A5 JPWO2023190575A5 (https=) 2024-03-08
JP7451827B2 true JP7451827B2 (ja) 2024-03-18

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ID=88201854

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JP2023548296A Active JP7451827B2 (ja) 2022-03-30 2023-03-28 回路基板の製造方法及び回路基板
JP2024033575A Pending JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Family Applications After (1)

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JP2024033575A Pending JP2024055999A (ja) 2022-03-30 2024-03-06 回路基板の製造方法及び回路基板

Country Status (2)

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JP (2) JP7451827B2 (https=)
WO (1) WO2023190575A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203313A (ja) 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2008218907A (ja) 2007-03-07 2008-09-18 Mitsubishi Electric Corp 回路基板及びパワーモジュール
JP2017085077A (ja) 2015-10-27 2017-05-18 Ｊｘ金属株式会社 回路基板用金属板成形品および、パワーモジュールの製造方法
JP2020191372A (ja) 2019-05-21 2020-11-26 日本発條株式会社 樹脂モールド回路体、金型、製造方法、及び回路基板
JP2021132216A (ja) 2017-06-21 2021-09-09 日本発條株式会社 回路基板の製造方法
WO2021200965A1 (ja) 2020-03-31 2021-10-07 デンカ株式会社 複合体シート

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006077172A (ja) * 2004-09-10 2006-03-23 Sumitomo Bakelite Co Ltd 絶縁性樹脂組成物、その製造方法及び電子部品
US20130193452A1 (en) * 2012-01-31 2013-08-01 E.I. Du Pont De Nemours And Company Light emitting diode system and methods relating thereto
JP2015093075A (ja) * 2013-11-12 2015-05-18 日本碍子株式会社 熱調理器具
CN109892022A (zh) * 2016-09-01 2019-06-14 Ａｇｃ株式会社 布线基板及其制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203313A (ja) 1999-11-09 2001-07-27 Matsushita Electric Ind Co Ltd 熱伝導基板およびその製造方法
JP2008218907A (ja) 2007-03-07 2008-09-18 Mitsubishi Electric Corp 回路基板及びパワーモジュール
JP2017085077A (ja) 2015-10-27 2017-05-18 Ｊｘ金属株式会社 回路基板用金属板成形品および、パワーモジュールの製造方法
JP2021132216A (ja) 2017-06-21 2021-09-09 日本発條株式会社 回路基板の製造方法
JP2020191372A (ja) 2019-05-21 2020-11-26 日本発條株式会社 樹脂モールド回路体、金型、製造方法、及び回路基板
WO2021200965A1 (ja) 2020-03-31 2021-10-07 デンカ株式会社 複合体シート

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JPWO2023190575A1 (https=) 2023-10-05
WO2023190575A1 (ja) 2023-10-05
JP2024055999A (ja) 2024-04-19

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