JPWO2023189054A5 - - Google Patents

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Publication number
JPWO2023189054A5
JPWO2023189054A5 JP2024511471A JP2024511471A JPWO2023189054A5 JP WO2023189054 A5 JPWO2023189054 A5 JP WO2023189054A5 JP 2024511471 A JP2024511471 A JP 2024511471A JP 2024511471 A JP2024511471 A JP 2024511471A JP WO2023189054 A5 JPWO2023189054 A5 JP WO2023189054A5
Authority
JP
Japan
Prior art keywords
trench
semiconductor device
gate
main surface
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511471A
Other languages
English (en)
Japanese (ja)
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JPWO2023189054A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/006633 external-priority patent/WO2023189054A1/ja
Publication of JPWO2023189054A1 publication Critical patent/JPWO2023189054A1/ja
Publication of JPWO2023189054A5 publication Critical patent/JPWO2023189054A5/ja
Pending legal-status Critical Current

Links

JP2024511471A 2022-03-31 2023-02-24 Pending JPWO2023189054A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022061316 2022-03-31
JP2022061314 2022-03-31
PCT/JP2023/006633 WO2023189054A1 (ja) 2022-03-31 2023-02-24 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2023189054A1 JPWO2023189054A1 (https=) 2023-10-05
JPWO2023189054A5 true JPWO2023189054A5 (https=) 2024-12-10

Family

ID=88200448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511471A Pending JPWO2023189054A1 (https=) 2022-03-31 2023-02-24

Country Status (3)

Country Link
US (1) US20250015078A1 (https=)
JP (1) JPWO2023189054A1 (https=)
WO (1) WO2023189054A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025121036A1 (ja) * 2023-12-05 2025-06-12 ローム株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6533613B2 (ja) * 2013-08-28 2019-06-19 ローム株式会社 半導体装置
DE112015004374B4 (de) * 2014-09-26 2019-02-14 Mitsubishi Electric Corporation Halbleitervorrichtung
DE212019000104U1 (de) * 2018-08-07 2020-02-19 Rohm Co., Ltd. SiC-Halbleitervorrichtung
JP7234713B2 (ja) * 2019-03-14 2023-03-08 富士電機株式会社 半導体装置

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