JPWO2023157888A1 - - Google Patents
Info
- Publication number
- JPWO2023157888A1 JPWO2023157888A1 JP2024501412A JP2024501412A JPWO2023157888A1 JP WO2023157888 A1 JPWO2023157888 A1 JP WO2023157888A1 JP 2024501412 A JP2024501412 A JP 2024501412A JP 2024501412 A JP2024501412 A JP 2024501412A JP WO2023157888 A1 JPWO2023157888 A1 JP WO2023157888A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022022940 | 2022-02-17 | ||
| PCT/JP2023/005314 WO2023157888A1 (ja) | 2022-02-17 | 2023-02-15 | 露光方法、デバイス製造方法、露光装置、及び露光システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023157888A1 true JPWO2023157888A1 (https=) | 2023-08-24 |
| JPWO2023157888A5 JPWO2023157888A5 (https=) | 2024-10-24 |
Family
ID=87578355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024501412A Pending JPWO2023157888A1 (https=) | 2022-02-17 | 2023-02-15 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240377754A1 (https=) |
| EP (1) | EP4481498A4 (https=) |
| JP (1) | JPWO2023157888A1 (https=) |
| KR (1) | KR20240135813A (https=) |
| CN (1) | CN118871862A (https=) |
| TW (1) | TW202338519A (https=) |
| WO (1) | WO2023157888A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI873898B (zh) * | 2023-10-05 | 2025-02-21 | 力晶積成電子製造股份有限公司 | 用於曝光製程的拼接方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215022A (ja) * | 1988-02-24 | 1989-08-29 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPH05136020A (ja) * | 1991-11-11 | 1993-06-01 | Fujitsu Ltd | 半導体装置の露光方法 |
| JP2007199711A (ja) * | 2005-12-28 | 2007-08-09 | Nikon Corp | 露光システム、デバイス製造システム、露光方法及びデバイスの製造方法 |
| JP2017090747A (ja) * | 2015-11-12 | 2017-05-25 | ウシオ電機株式会社 | 露光装置、基板製造システム、露光方法、および基板製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3198310B2 (ja) | 1993-01-06 | 2001-08-13 | 株式会社ニコン | 露光方法及び装置 |
| US6624433B2 (en) | 1994-02-22 | 2003-09-23 | Nikon Corporation | Method and apparatus for positioning substrate and the like |
| JPH07249558A (ja) * | 1994-03-09 | 1995-09-26 | Nikon Corp | 位置合わせ方法 |
| US5637129A (en) | 1995-11-03 | 1997-06-10 | Owens-Brockway Glass Container Inc. | Glass melting furnace plunger needle set-up fixture |
| SE522531C2 (sv) * | 1999-11-24 | 2004-02-17 | Micronic Laser Systems Ab | Metod och anordning för märkning av halvledare |
| US20050015608A1 (en) | 2003-07-16 | 2005-01-20 | Pkware, Inc. | Method for strongly encrypting .ZIP files |
| JP4266079B2 (ja) * | 2001-04-09 | 2009-05-20 | 株式会社東芝 | 原版とその作製方法及びその原版を用いた露光方法 |
| JP2008268578A (ja) * | 2007-04-20 | 2008-11-06 | Toppan Printing Co Ltd | 分割露光装置及び分割露光方法 |
| TWI443472B (zh) | 2007-07-13 | 2014-07-01 | 尼康股份有限公司 | Pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method and element |
| JP2011181715A (ja) * | 2010-03-02 | 2011-09-15 | Nikon Corp | 露光装置 |
| JP5703069B2 (ja) * | 2010-09-30 | 2015-04-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 描画装置および描画方法 |
| KR102552792B1 (ko) | 2015-02-23 | 2023-07-06 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 디바이스 제조 방법 |
| JP6664897B2 (ja) | 2015-07-22 | 2020-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| EP3598236A4 (en) | 2017-03-16 | 2021-01-20 | Nikon Corporation | CONTROL DEVICE AND CONTROL METHOD, EXPOSURE DEVICE AND EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, DATA GENERATING METHOD AND PROGRAM |
-
2023
- 2023-02-15 CN CN202380019504.5A patent/CN118871862A/zh active Pending
- 2023-02-15 WO PCT/JP2023/005314 patent/WO2023157888A1/ja not_active Ceased
- 2023-02-15 JP JP2024501412A patent/JPWO2023157888A1/ja active Pending
- 2023-02-15 KR KR1020247027066A patent/KR20240135813A/ko active Pending
- 2023-02-15 EP EP23756413.3A patent/EP4481498A4/en active Pending
- 2023-02-16 TW TW112105594A patent/TW202338519A/zh unknown
-
2024
- 2024-07-23 US US18/780,663 patent/US20240377754A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215022A (ja) * | 1988-02-24 | 1989-08-29 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPH05136020A (ja) * | 1991-11-11 | 1993-06-01 | Fujitsu Ltd | 半導体装置の露光方法 |
| JP2007199711A (ja) * | 2005-12-28 | 2007-08-09 | Nikon Corp | 露光システム、デバイス製造システム、露光方法及びデバイスの製造方法 |
| JP2017090747A (ja) * | 2015-11-12 | 2017-05-25 | ウシオ電機株式会社 | 露光装置、基板製造システム、露光方法、および基板製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240135813A (ko) | 2024-09-12 |
| EP4481498A4 (en) | 2026-04-01 |
| TW202338519A (zh) | 2023-10-01 |
| WO2023157888A1 (ja) | 2023-08-24 |
| CN118871862A (zh) | 2024-10-29 |
| EP4481498A1 (en) | 2024-12-25 |
| US20240377754A1 (en) | 2024-11-14 |
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