JPWO2023136260A5 - - Google Patents

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Publication number
JPWO2023136260A5
JPWO2023136260A5 JP2023574046A JP2023574046A JPWO2023136260A5 JP WO2023136260 A5 JPWO2023136260 A5 JP WO2023136260A5 JP 2023574046 A JP2023574046 A JP 2023574046A JP 2023574046 A JP2023574046 A JP 2023574046A JP WO2023136260 A5 JPWO2023136260 A5 JP WO2023136260A5
Authority
JP
Japan
Prior art keywords
cleaning solution
acid
semiconductor substrate
forming
underlayer film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023574046A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023136260A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/000437 external-priority patent/WO2023136260A1/ja
Publication of JPWO2023136260A1 publication Critical patent/JPWO2023136260A1/ja
Publication of JPWO2023136260A5 publication Critical patent/JPWO2023136260A5/ja
Pending legal-status Critical Current

Links

JP2023574046A 2022-01-14 2023-01-11 Pending JPWO2023136260A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022004064 2022-01-14
PCT/JP2023/000437 WO2023136260A1 (ja) 2022-01-14 2023-01-11 半導体基板の製造方法、レジスト下層膜の形成方法及び洗浄液

Publications (2)

Publication Number Publication Date
JPWO2023136260A1 JPWO2023136260A1 (https=) 2023-07-20
JPWO2023136260A5 true JPWO2023136260A5 (https=) 2025-10-21

Family

ID=87279192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574046A Pending JPWO2023136260A1 (https=) 2022-01-14 2023-01-11

Country Status (6)

Country Link
US (1) US20240369931A1 (https=)
JP (1) JPWO2023136260A1 (https=)
KR (1) KR20240137561A (https=)
CN (1) CN118435121A (https=)
TW (1) TW202331416A (https=)
WO (1) WO2023136260A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4793583B2 (ja) * 2004-10-14 2011-10-12 日産化学工業株式会社 金属酸化物を含むリソグラフィー用下層膜形成組成物
US9093279B2 (en) * 2011-07-20 2015-07-28 Nissan Chemical Industries, Ltd. Thin film forming composition for lithography containing titanium and silicon
US9070548B2 (en) 2012-03-06 2015-06-30 Rohm And Haas Electronic Materials Llc Metal hardmask compositions
US9201305B2 (en) * 2013-06-28 2015-12-01 Az Electronic Materials (Luxembourg) S.A.R.L. Spin-on compositions of soluble metal oxide carboxylates and methods of their use
KR102317541B1 (ko) * 2013-10-07 2021-10-27 닛산 가가쿠 가부시키가이샤 폴리산을 포함하는 메탈함유 레지스트 하층막 형성조성물
JP6603487B2 (ja) * 2015-06-22 2019-11-06 株式会社Screenホールディングス 基板処理装置および基板処理方法
KR102791311B1 (ko) * 2016-08-12 2025-04-04 인프리아 코포레이션 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법
KR101910157B1 (ko) * 2018-08-06 2018-10-19 영창케미칼 주식회사 유무기 하이브리드 포토레지스트 공정액 조성물
JP2020042217A (ja) * 2018-09-12 2020-03-19 Jsr株式会社 組成物、金属又は半金属含有膜形成用組成物、金属又は半金属含有膜及びその製造方法並びにパターン形成方法
JP7274920B2 (ja) * 2019-04-11 2023-05-17 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法
JP7294859B2 (ja) * 2019-04-11 2023-06-20 東京応化工業株式会社 洗浄液、及び金属レジストを備えた支持体の洗浄方法

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