JPWO2023127385A5 - - Google Patents

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Publication number
JPWO2023127385A5
JPWO2023127385A5 JP2023570747A JP2023570747A JPWO2023127385A5 JP WO2023127385 A5 JPWO2023127385 A5 JP WO2023127385A5 JP 2023570747 A JP2023570747 A JP 2023570747A JP 2023570747 A JP2023570747 A JP 2023570747A JP WO2023127385 A5 JPWO2023127385 A5 JP WO2023127385A5
Authority
JP
Japan
Prior art keywords
contacts
semiconductor chip
power supply
back surface
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023570747A
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English (en)
Japanese (ja)
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JPWO2023127385A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/044249 external-priority patent/WO2023127385A1/ja
Publication of JPWO2023127385A1 publication Critical patent/JPWO2023127385A1/ja
Publication of JPWO2023127385A5 publication Critical patent/JPWO2023127385A5/ja
Pending legal-status Critical Current

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JP2023570747A 2021-12-27 2022-11-30 Pending JPWO2023127385A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021212959 2021-12-27
PCT/JP2022/044249 WO2023127385A1 (ja) 2021-12-27 2022-11-30 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPWO2023127385A1 JPWO2023127385A1 (https=) 2023-07-06
JPWO2023127385A5 true JPWO2023127385A5 (https=) 2024-09-11

Family

ID=86998906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023570747A Pending JPWO2023127385A1 (https=) 2021-12-27 2022-11-30

Country Status (4)

Country Link
US (1) US20240347460A1 (https=)
JP (1) JPWO2023127385A1 (https=)
CN (1) CN118355485A (https=)
WO (1) WO2023127385A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005032839A (ja) * 2003-07-08 2005-02-03 Toshiba Microelectronics Corp 半導体集積回路及びマスターチップ
JP2018182213A (ja) * 2017-04-19 2018-11-15 富士通株式会社 半導体装置及び半導体装置の製造方法
CN112753098B (zh) * 2018-09-28 2024-10-18 株式会社索思未来 半导体装置
JP7307355B2 (ja) * 2018-09-28 2023-07-12 株式会社ソシオネクスト 半導体集積回路装置および半導体パッケージ構造
JP7315016B2 (ja) * 2019-10-11 2023-07-26 株式会社ソシオネクスト 半導体装置

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