JPWO2023080093A5 - - Google Patents
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- Publication number
- JPWO2023080093A5 JPWO2023080093A5 JP2023558018A JP2023558018A JPWO2023080093A5 JP WO2023080093 A5 JPWO2023080093 A5 JP WO2023080093A5 JP 2023558018 A JP2023558018 A JP 2023558018A JP 2023558018 A JP2023558018 A JP 2023558018A JP WO2023080093 A5 JPWO2023080093 A5 JP WO2023080093A5
- Authority
- JP
- Japan
- Prior art keywords
- module according
- semiconductor module
- terminal
- main surface
- sealing insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 27
- 239000000945 filler Substances 0.000 claims 10
- 239000012212 insulator Substances 0.000 claims 10
- 238000007789 sealing Methods 0.000 claims 10
- 230000004308 accommodation Effects 0.000 claims 5
- 239000010410 layer Substances 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021181324 | 2021-11-05 | ||
| PCT/JP2022/040505 WO2023080093A1 (ja) | 2021-11-05 | 2022-10-28 | 半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023080093A1 JPWO2023080093A1 (https=) | 2023-05-11 |
| JPWO2023080093A5 true JPWO2023080093A5 (https=) | 2024-07-23 |
Family
ID=86241140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023558018A Pending JPWO2023080093A1 (https=) | 2021-11-05 | 2022-10-28 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240282656A1 (https=) |
| JP (1) | JPWO2023080093A1 (https=) |
| CN (1) | CN118176581A (https=) |
| DE (1) | DE112022004777T5 (https=) |
| WO (1) | WO2023080093A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7163054B2 (ja) * | 2017-04-20 | 2022-10-31 | ローム株式会社 | 半導体装置 |
| JP7038518B2 (ja) * | 2017-10-11 | 2022-03-18 | ローム株式会社 | 半導体装置 |
| JP7530202B2 (ja) * | 2019-05-23 | 2024-08-07 | ローム株式会社 | 半導体装置 |
| JP2020202313A (ja) * | 2019-06-11 | 2020-12-17 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP7543698B2 (ja) | 2020-05-19 | 2024-09-03 | 東洋製罐株式会社 | 飛行体の吐出装置 |
-
2022
- 2022-10-28 JP JP2023558018A patent/JPWO2023080093A1/ja active Pending
- 2022-10-28 CN CN202280072920.7A patent/CN118176581A/zh active Pending
- 2022-10-28 DE DE112022004777.1T patent/DE112022004777T5/de active Pending
- 2022-10-28 WO PCT/JP2022/040505 patent/WO2023080093A1/ja not_active Ceased
-
2024
- 2024-05-01 US US18/651,815 patent/US20240282656A1/en active Pending
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