JPWO2023047881A1 - - Google Patents

Info

Publication number
JPWO2023047881A1
JPWO2023047881A1 JP2023549428A JP2023549428A JPWO2023047881A1 JP WO2023047881 A1 JPWO2023047881 A1 JP WO2023047881A1 JP 2023549428 A JP2023549428 A JP 2023549428A JP 2023549428 A JP2023549428 A JP 2023549428A JP WO2023047881 A1 JPWO2023047881 A1 JP WO2023047881A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023549428A
Other languages
Japanese (ja)
Other versions
JP7563621B2 (ja
JPWO2023047881A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023047881A1 publication Critical patent/JPWO2023047881A1/ja
Publication of JPWO2023047881A5 publication Critical patent/JPWO2023047881A5/ja
Priority to JP2024159670A priority Critical patent/JP7816447B2/ja
Application granted granted Critical
Publication of JP7563621B2 publication Critical patent/JP7563621B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Inverter Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023549428A 2021-09-21 2022-08-25 半導体装置およびその製造方法 Active JP7563621B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024159670A JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021153458 2021-09-21
JP2021153458 2021-09-21
PCT/JP2022/032094 WO2023047881A1 (ja) 2021-09-21 2022-08-25 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024159670A Division JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023047881A1 true JPWO2023047881A1 (https=) 2023-03-30
JPWO2023047881A5 JPWO2023047881A5 (https=) 2023-12-13
JP7563621B2 JP7563621B2 (ja) 2024-10-08

Family

ID=85720542

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023549428A Active JP7563621B2 (ja) 2021-09-21 2022-08-25 半導体装置およびその製造方法
JP2024159670A Active JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024159670A Active JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Country Status (4)

Country Link
US (1) US20240258264A1 (https=)
JP (2) JP7563621B2 (https=)
CN (1) CN117941059A (https=)
WO (1) WO2023047881A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112024000591T5 (de) * 2023-04-25 2025-11-27 Rohm Co., Ltd. Halbleiterbauteil und verfahren zur herstellung des halbleiterbauteils
JP2026013236A (ja) * 2024-07-16 2026-01-28 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021254A (ja) * 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP2013034029A (ja) * 2008-04-09 2013-02-14 Fuji Electric Co Ltd 半導体装置
JP2013143439A (ja) * 2012-01-10 2013-07-22 Hitachi Automotive Systems Ltd パワー半導体モジュール、パワーモジュールおよびパワーモジュールの製造方法
WO2017119226A1 (ja) * 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5661052B2 (ja) 2012-01-18 2015-01-28 三菱電機株式会社 パワー半導体モジュールおよびその製造方法
JP5879238B2 (ja) 2012-09-26 2016-03-08 日立オートモティブシステムズ株式会社 パワー半導体モジュール
JP6252293B2 (ja) 2014-03-26 2017-12-27 株式会社デンソー 半導体装置
JP7006015B2 (ja) 2017-08-23 2022-01-24 株式会社デンソー 半導体モジュールの製造方法
JP7035868B2 (ja) 2018-07-13 2022-03-15 株式会社デンソー 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013034029A (ja) * 2008-04-09 2013-02-14 Fuji Electric Co Ltd 半導体装置
JP2013021254A (ja) * 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP2013143439A (ja) * 2012-01-10 2013-07-22 Hitachi Automotive Systems Ltd パワー半導体モジュール、パワーモジュールおよびパワーモジュールの製造方法
WO2017119226A1 (ja) * 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置

Also Published As

Publication number Publication date
CN117941059A (zh) 2024-04-26
WO2023047881A1 (ja) 2023-03-30
JP2024175039A (ja) 2024-12-17
JP7563621B2 (ja) 2024-10-08
US20240258264A1 (en) 2024-08-01
JP7816447B2 (ja) 2026-02-18

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