JP7563621B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

Info

Publication number
JP7563621B2
JP7563621B2 JP2023549428A JP2023549428A JP7563621B2 JP 7563621 B2 JP7563621 B2 JP 7563621B2 JP 2023549428 A JP2023549428 A JP 2023549428A JP 2023549428 A JP2023549428 A JP 2023549428A JP 7563621 B2 JP7563621 B2 JP 7563621B2
Authority
JP
Japan
Prior art keywords
semiconductor element
metal body
terminal
wiring
surface metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023549428A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023047881A1 (https=
JPWO2023047881A5 (https=
Inventor
崇功 川島
真二 平光
知巳 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of JPWO2023047881A1 publication Critical patent/JPWO2023047881A1/ja
Publication of JPWO2023047881A5 publication Critical patent/JPWO2023047881A5/ja
Priority to JP2024159670A priority Critical patent/JP7816447B2/ja
Application granted granted Critical
Publication of JP7563621B2 publication Critical patent/JP7563621B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/755—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a laterally-adjacent insulating package substrate, interpose or RDL

Landscapes

  • Inverter Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023549428A 2021-09-21 2022-08-25 半導体装置およびその製造方法 Active JP7563621B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024159670A JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021153458 2021-09-21
JP2021153458 2021-09-21
PCT/JP2022/032094 WO2023047881A1 (ja) 2021-09-21 2022-08-25 半導体装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024159670A Division JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2023047881A1 JPWO2023047881A1 (https=) 2023-03-30
JPWO2023047881A5 JPWO2023047881A5 (https=) 2023-12-13
JP7563621B2 true JP7563621B2 (ja) 2024-10-08

Family

ID=85720542

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023549428A Active JP7563621B2 (ja) 2021-09-21 2022-08-25 半導体装置およびその製造方法
JP2024159670A Active JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024159670A Active JP7816447B2 (ja) 2021-09-21 2024-09-16 半導体装置

Country Status (4)

Country Link
US (1) US20240258264A1 (https=)
JP (2) JP7563621B2 (https=)
CN (1) CN117941059A (https=)
WO (1) WO2023047881A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112024000591T5 (de) * 2023-04-25 2025-11-27 Rohm Co., Ltd. Halbleiterbauteil und verfahren zur herstellung des halbleiterbauteils
JP2026013236A (ja) * 2024-07-16 2026-01-28 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013021254A (ja) 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP2013034029A (ja) 2008-04-09 2013-02-14 Fuji Electric Co Ltd 半導体装置
JP2013143439A (ja) 2012-01-10 2013-07-22 Hitachi Automotive Systems Ltd パワー半導体モジュール、パワーモジュールおよびパワーモジュールの製造方法
WO2017119226A1 (ja) 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5661052B2 (ja) 2012-01-18 2015-01-28 三菱電機株式会社 パワー半導体モジュールおよびその製造方法
JP5879238B2 (ja) 2012-09-26 2016-03-08 日立オートモティブシステムズ株式会社 パワー半導体モジュール
JP6252293B2 (ja) 2014-03-26 2017-12-27 株式会社デンソー 半導体装置
JP7006015B2 (ja) 2017-08-23 2022-01-24 株式会社デンソー 半導体モジュールの製造方法
JP7035868B2 (ja) 2018-07-13 2022-03-15 株式会社デンソー 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013034029A (ja) 2008-04-09 2013-02-14 Fuji Electric Co Ltd 半導体装置
JP2013021254A (ja) 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP2013143439A (ja) 2012-01-10 2013-07-22 Hitachi Automotive Systems Ltd パワー半導体モジュール、パワーモジュールおよびパワーモジュールの製造方法
WO2017119226A1 (ja) 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置

Also Published As

Publication number Publication date
CN117941059A (zh) 2024-04-26
WO2023047881A1 (ja) 2023-03-30
JP2024175039A (ja) 2024-12-17
US20240258264A1 (en) 2024-08-01
JPWO2023047881A1 (https=) 2023-03-30
JP7816447B2 (ja) 2026-02-18

Similar Documents

Publication Publication Date Title
JP7816447B2 (ja) 半導体装置
JP7647630B2 (ja) 半導体装置
US20240079383A1 (en) Semiconductor device
WO2020184052A1 (ja) 半導体モジュール
WO2025142810A1 (ja) 半導体装置
WO2022024567A1 (ja) 半導体装置
JP7363587B2 (ja) 半導体装置
US11996344B2 (en) Semiconductor device
JP2022152703A (ja) 半導体装置
JP2025041798A (ja) 半導体装置およびインバータ
JP2024177306A (ja) 半導体装置
JP2026002560A (ja) 半導体モジュールおよび電力変換装置
WO2025197363A1 (ja) 半導体装置およびその製造方法
WO2025142811A1 (ja) 半導体装置
JP2025145247A (ja) 半導体装置
WO2024062845A1 (ja) 半導体装置
JP2025171942A (ja) 半導体装置
WO2025234243A1 (ja) 半導体装置
JP2024000845A (ja) 半導体装置
JP2024168815A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230914

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230914

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240827

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240909

R150 Certificate of patent or registration of utility model

Ref document number: 7563621

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150