JPWO2023047881A1 - - Google Patents

Info

Publication number
JPWO2023047881A1
JPWO2023047881A1 JP2023549428A JP2023549428A JPWO2023047881A1 JP WO2023047881 A1 JPWO2023047881 A1 JP WO2023047881A1 JP 2023549428 A JP2023549428 A JP 2023549428A JP 2023549428 A JP2023549428 A JP 2023549428A JP WO2023047881 A1 JPWO2023047881 A1 JP WO2023047881A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023549428A
Other versions
JPWO2023047881A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023047881A1 publication Critical patent/JPWO2023047881A1/ja
Publication of JPWO2023047881A5 publication Critical patent/JPWO2023047881A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
JP2023549428A 2021-09-21 2022-08-25 Pending JPWO2023047881A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021153458 2021-09-21
PCT/JP2022/032094 WO2023047881A1 (ja) 2021-09-21 2022-08-25 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023047881A1 true JPWO2023047881A1 (ja) 2023-03-30
JPWO2023047881A5 JPWO2023047881A5 (ja) 2023-12-13

Family

ID=85720542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023549428A Pending JPWO2023047881A1 (ja) 2021-09-21 2022-08-25

Country Status (3)

Country Link
JP (1) JPWO2023047881A1 (ja)
CN (1) CN117941059A (ja)
WO (1) WO2023047881A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112009000447B4 (de) * 2008-04-09 2016-07-14 Fuji Electric Co., Ltd. Halbleitervorrichtung und Verfahren zu ihrer Herstellung
JP2013021254A (ja) * 2011-07-14 2013-01-31 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
JP5690752B2 (ja) * 2012-01-10 2015-03-25 日立オートモティブシステムズ株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
WO2017119226A1 (ja) * 2016-01-05 2017-07-13 日立オートモティブシステムズ株式会社 パワー半導体装置

Also Published As

Publication number Publication date
CN117941059A (zh) 2024-04-26
WO2023047881A1 (ja) 2023-03-30

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230914

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230914