JPWO2023112195A1 - - Google Patents

Info

Publication number
JPWO2023112195A1
JPWO2023112195A1 JP2023567380A JP2023567380A JPWO2023112195A1 JP WO2023112195 A1 JPWO2023112195 A1 JP WO2023112195A1 JP 2023567380 A JP2023567380 A JP 2023567380A JP 2023567380 A JP2023567380 A JP 2023567380A JP WO2023112195 A1 JPWO2023112195 A1 JP WO2023112195A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023567380A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023112195A1 publication Critical patent/JPWO2023112195A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
JP2023567380A 2021-12-15 2021-12-15 Pending JPWO2023112195A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/046236 WO2023112195A1 (ja) 2021-12-15 2021-12-15 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2023112195A1 true JPWO2023112195A1 (ja) 2023-06-22

Family

ID=86773790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023567380A Pending JPWO2023112195A1 (ja) 2021-12-15 2021-12-15

Country Status (2)

Country Link
JP (1) JPWO2023112195A1 (ja)
WO (1) WO2023112195A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104247012B (zh) * 2012-10-01 2017-08-25 富士电机株式会社 半导体装置及其制造方法
JP6244272B2 (ja) * 2014-06-30 2017-12-06 株式会社日立製作所 半導体装置
JP2016167527A (ja) * 2015-03-10 2016-09-15 株式会社日立製作所 半導体モジュール及びその製造方法
CN110235243B (zh) * 2017-01-30 2023-07-18 三菱电机株式会社 功率半导体装置的制造方法及功率半导体装置
JP7000871B2 (ja) * 2018-01-16 2022-01-19 三菱電機株式会社 半導体装置および電力変換装置
JP7091878B2 (ja) * 2018-06-22 2022-06-28 三菱電機株式会社 パワーモジュール、電力変換装置、及びパワーモジュールの製造方法
JP7062071B2 (ja) * 2018-08-21 2022-05-02 三菱電機株式会社 電力用半導体装置およびその製造方法、ならびに電力変換装置

Also Published As

Publication number Publication date
WO2023112195A1 (ja) 2023-06-22

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231020