JPWO2023042811A5 - - Google Patents
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- JPWO2023042811A5 JPWO2023042811A5 JP2023524112A JP2023524112A JPWO2023042811A5 JP WO2023042811 A5 JPWO2023042811 A5 JP WO2023042811A5 JP 2023524112 A JP2023524112 A JP 2023524112A JP 2023524112 A JP2023524112 A JP 2023524112A JP WO2023042811 A5 JPWO2023042811 A5 JP WO2023042811A5
- Authority
- JP
- Japan
- Prior art keywords
- formula
- component
- alkyl group
- carbon atoms
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 claims 35
- 230000001070 adhesive effect Effects 0.000 claims 35
- 125000000217 alkyl group Chemical group 0.000 claims 27
- 125000004432 carbon atom Chemical group C* 0.000 claims 27
- 239000002904 solvent Substances 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 23
- 239000004065 semiconductor Substances 0.000 claims 21
- 238000000034 method Methods 0.000 claims 13
- 150000001408 amides Chemical class 0.000 claims 12
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims 12
- 239000012790 adhesive layer Substances 0.000 claims 10
- 125000002947 alkylene group Chemical group 0.000 claims 9
- 239000000010 aprotic solvent Substances 0.000 claims 9
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 9
- 238000004140 cleaning Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 3
- 239000004925 Acrylic resin Substances 0.000 claims 3
- 229920000178 Acrylic resin Polymers 0.000 claims 3
- 239000004952 Polyamide Substances 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 3
- 239000004793 Polystyrene Substances 0.000 claims 3
- 125000002252 acyl group Chemical group 0.000 claims 3
- 229910052799 carbon Inorganic materials 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 3
- 229910052736 halogen Inorganic materials 0.000 claims 3
- 125000005843 halogen group Chemical group 0.000 claims 3
- 238000006459 hydrosilylation reaction Methods 0.000 claims 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 239000005011 phenolic resin Substances 0.000 claims 3
- 229920001568 phenolic resin Polymers 0.000 claims 3
- 229920002647 polyamide Polymers 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- 229920002223 polystyrene Polymers 0.000 claims 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 3
- 229910052717 sulfur Inorganic materials 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023083161A JP7513158B2 (ja) | 2021-09-16 | 2023-05-19 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
| JP2024041051A JP2024061860A (ja) | 2021-09-16 | 2024-03-15 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021151098 | 2021-09-16 | ||
| JP2021151098 | 2021-09-16 | ||
| PCT/JP2022/034143 WO2023042811A1 (ja) | 2021-09-16 | 2022-09-13 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023083161A Division JP7513158B2 (ja) | 2021-09-16 | 2023-05-19 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
| JP2024041051A Division JP2024061860A (ja) | 2021-09-16 | 2024-03-15 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042811A1 JPWO2023042811A1 (https=) | 2023-03-23 |
| JPWO2023042811A5 true JPWO2023042811A5 (https=) | 2024-02-02 |
| JP7468787B2 JP7468787B2 (ja) | 2024-04-16 |
Family
ID=85602922
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023524112A Active JP7468787B2 (ja) | 2021-09-16 | 2022-09-13 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
| JP2023083161A Active JP7513158B2 (ja) | 2021-09-16 | 2023-05-19 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
| JP2024041051A Pending JP2024061860A (ja) | 2021-09-16 | 2024-03-15 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023083161A Active JP7513158B2 (ja) | 2021-09-16 | 2023-05-19 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
| JP2024041051A Pending JP2024061860A (ja) | 2021-09-16 | 2024-03-15 | 半導体基板の洗浄方法、加工された半導体基板の製造方法、及び、剥離及び溶解用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240132806A1 (https=) |
| EP (1) | EP4404244A4 (https=) |
| JP (3) | JP7468787B2 (https=) |
| KR (2) | KR102719005B1 (https=) |
| CN (2) | CN120199681A (https=) |
| TW (2) | TW202504983A (https=) |
| WO (1) | WO2023042811A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024058025A1 (https=) * | 2022-09-13 | 2024-03-21 | ||
| WO2025094887A1 (ja) * | 2023-11-02 | 2025-05-08 | 日産化学株式会社 | 接着剤組成物、積層体、及び加工された半導体基板の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6818608B2 (en) | 2002-02-01 | 2004-11-16 | John C. Moore | Cured polymers dissolving compositions |
| JP2014133855A (ja) | 2012-12-11 | 2014-07-24 | Fujifilm Corp | シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法 |
| JP6194394B2 (ja) * | 2016-07-28 | 2017-09-06 | 東京応化工業株式会社 | 半導体装置の製造方法 |
| CN112602174B (zh) * | 2018-10-16 | 2023-12-08 | 株式会社力森诺科 | 组合物、粘接性聚合物的清洗方法、器件晶圆的制造方法和支撑晶圆的再生方法 |
| US12221595B2 (en) * | 2019-01-15 | 2025-02-11 | Resonac Corporation | Decomposing/cleaning composition, method for cleaning adhesive polymer, and method for producing device wafer |
| US11866676B2 (en) * | 2019-02-15 | 2024-01-09 | Nissan Chemical Corporation | Cleaning agent composition and cleaning method |
| JP7574798B2 (ja) * | 2019-08-27 | 2024-10-29 | 株式会社レゾナック | 組成物、及び接着性ポリマーの洗浄方法 |
| WO2021100651A1 (ja) * | 2019-11-20 | 2021-05-27 | 日産化学株式会社 | 洗浄剤組成物及び洗浄方法 |
| WO2021106460A1 (ja) * | 2019-11-25 | 2021-06-03 | 昭和電工株式会社 | 分解洗浄組成物の製造方法 |
-
2022
- 2022-09-13 TW TW113139759A patent/TW202504983A/zh unknown
- 2022-09-13 KR KR1020237022014A patent/KR102719005B1/ko active Active
- 2022-09-13 JP JP2023524112A patent/JP7468787B2/ja active Active
- 2022-09-13 CN CN202510341744.8A patent/CN120199681A/zh active Pending
- 2022-09-13 WO PCT/JP2022/034143 patent/WO2023042811A1/ja not_active Ceased
- 2022-09-13 TW TW111134503A patent/TWI862980B/zh active
- 2022-09-13 EP EP22869958.3A patent/EP4404244A4/en active Pending
- 2022-09-13 KR KR1020247034198A patent/KR20240153621A/ko active Pending
- 2022-09-13 CN CN202280007459.7A patent/CN116507683B/zh active Active
- 2022-09-13 US US18/037,680 patent/US20240132806A1/en active Pending
-
2023
- 2023-05-19 JP JP2023083161A patent/JP7513158B2/ja active Active
-
2024
- 2024-03-15 JP JP2024041051A patent/JP2024061860A/ja active Pending
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