JPWO2019212008A5 - - Google Patents
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- Publication number
- JPWO2019212008A5 JPWO2019212008A5 JP2020517050A JP2020517050A JPWO2019212008A5 JP WO2019212008 A5 JPWO2019212008 A5 JP WO2019212008A5 JP 2020517050 A JP2020517050 A JP 2020517050A JP 2020517050 A JP2020517050 A JP 2020517050A JP WO2019212008 A5 JPWO2019212008 A5 JP WO2019212008A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temporary adhesive
- adhesive layer
- wafer
- release agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 31
- -1 siloxane unit Chemical group 0.000 claims 18
- 239000012790 adhesive layer Substances 0.000 claims 16
- 239000000853 adhesive Substances 0.000 claims 12
- 230000001070 adhesive effect Effects 0.000 claims 12
- 239000003795 chemical substances by application Substances 0.000 claims 10
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- 239000010410 layer Substances 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 5
- 125000003700 epoxy group Chemical group 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 4
- 125000000217 alkyl group Chemical group 0.000 claims 3
- 239000003112 inhibitor Substances 0.000 claims 3
- 238000006116 polymerization reaction Methods 0.000 claims 3
- 239000002904 solvent Substances 0.000 claims 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 2
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 125000003636 chemical group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- AFMVESZOYKHDBJ-UHFFFAOYSA-N fluoren-9-ol Chemical compound C1=CC=C2C(O)C3=CC=CC=C3C2=C1 AFMVESZOYKHDBJ-UHFFFAOYSA-N 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 238000006459 hydrosilylation reaction Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018088393 | 2018-05-01 | ||
| JP2018088393 | 2018-05-01 | ||
| PCT/JP2019/017197 WO2019212008A1 (ja) | 2018-05-01 | 2019-04-23 | 耐熱性重合禁止剤を含むポリシロキサンを含有する仮接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2019212008A1 JPWO2019212008A1 (ja) | 2021-06-10 |
| JPWO2019212008A5 true JPWO2019212008A5 (https=) | 2022-05-02 |
| JP7424969B2 JP7424969B2 (ja) | 2024-01-30 |
Family
ID=68386240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020517050A Active JP7424969B2 (ja) | 2018-05-01 | 2019-04-23 | 耐熱性重合禁止剤を含むポリシロキサンを含有する仮接着剤 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12559655B2 (https=) |
| EP (1) | EP3790038A4 (https=) |
| JP (1) | JP7424969B2 (https=) |
| KR (1) | KR102799545B1 (https=) |
| CN (1) | CN112074931A (https=) |
| SG (1) | SG11202010863YA (https=) |
| TW (2) | TWI900395B (https=) |
| WO (1) | WO2019212008A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202105574YA (en) * | 2018-11-28 | 2021-06-29 | Nissan Chemical Corp | Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate |
| CN115989142A (zh) * | 2020-08-27 | 2023-04-18 | 日产化学株式会社 | 层叠体及剥离剂组合物 |
| JP7730456B2 (ja) * | 2021-03-19 | 2025-08-28 | 日産化学株式会社 | 剥離剤組成物、積層体、積層体の製造方法、及び半導体基板の製造方法 |
| CN113372725A (zh) * | 2021-06-03 | 2021-09-10 | 广东恒大新材料科技有限公司 | 一种单组分加成型热固化硅橡胶组合物 |
| JPWO2023008204A1 (https=) * | 2021-07-26 | 2023-02-02 | ||
| JPWO2023032782A1 (https=) | 2021-08-30 | 2023-03-09 | ||
| EP4653507A1 (en) | 2023-01-18 | 2025-11-26 | Nissan Chemical Corporation | Adhesive composition, laminate, and method for producing processed semiconductor substrate |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1776837A (en) * | 1928-10-22 | 1930-09-30 | Florence B Maccarthy | Dial-telephone lock |
| FR2704553B1 (fr) | 1993-04-30 | 1995-06-09 | Rhone Poulenc Chimie | Alcools alpha-acétyléniques à longue chaîne comme inhibiteurs de réaction d'hydrosilylation, et leur application pour la préparation de compositions silicones durcissables stables. |
| AU2003299296A1 (en) | 2002-11-29 | 2004-06-23 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer |
| KR101278460B1 (ko) | 2005-03-01 | 2013-07-02 | 다우 코닝 코포레이션 | 반도체 가공을 위한 임시 웨이퍼 접착방법 |
| JP4523489B2 (ja) | 2005-05-30 | 2010-08-11 | 株式会社日立製作所 | 内部欠陥検査方法および内部欠陥検査装置 |
| US8911583B2 (en) | 2006-03-01 | 2014-12-16 | Thin Materials Ag | Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement |
| US20080014532A1 (en) * | 2006-07-14 | 2008-01-17 | 3M Innovative Properties Company | Laminate body, and method for manufacturing thin substrate using the laminate body |
| DE102008044200B4 (de) | 2008-11-28 | 2012-08-23 | Thin Materials Ag | Bonding-Verfahren |
| DE102008055155A1 (de) | 2008-12-23 | 2010-07-01 | Thin Materials Ag | Trennverfahren für ein Schichtsystem umfassend einen Wafer |
| KR20120132624A (ko) * | 2010-02-12 | 2012-12-06 | 다우 코닝 코포레이션 | 반도체 가공을 위한 임시 웨이퍼 접합 방법 |
| JP2012169573A (ja) * | 2011-02-17 | 2012-09-06 | Furukawa Electric Co Ltd:The | ダイシングダイボンドシートおよびｌｅｄ用サファイヤ基板の加工方法 |
| JP5409695B2 (ja) * | 2011-04-26 | 2014-02-05 | 信越化学工業株式会社 | オルガノポリシロキサン、オルガノポリシロキサンを含む仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法 |
| US9235121B2 (en) * | 2011-08-10 | 2016-01-12 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive film, permanent resist and method for producing permanent resist |
| JP5767159B2 (ja) | 2012-04-27 | 2015-08-19 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP5687230B2 (ja) | 2012-02-28 | 2015-03-18 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| JP5767161B2 (ja) * | 2012-05-08 | 2015-08-19 | 信越化学工業株式会社 | ウエハ加工用仮接着材、それを用いたウエハ加工用部材、ウエハ加工体、及び薄型ウエハの作製方法 |
| KR102077248B1 (ko) | 2013-01-25 | 2020-02-13 | 삼성전자주식회사 | 기판 가공 방법 |
| EP3020750B1 (en) | 2013-07-08 | 2025-09-03 | Momentive Performance Materials Japan LLC | Adhesiveness-imparting agent, adhesive polyorganosiloxane composition, and optical semiconductor device |
| US10903106B2 (en) * | 2014-06-10 | 2021-01-26 | Nissan Chemical Industries, Ltd. | Layered body of temporary adhesive |
| JP6437108B2 (ja) * | 2015-05-11 | 2018-12-12 | 富士フイルム株式会社 | 仮止め接着剤、接着フィルム、接着性支持体および積層体 |
| FR3048886A1 (fr) * | 2016-03-17 | 2017-09-22 | Bluestar Silicones France | Gel silicone adhesif a la peau |
| US11183415B2 (en) | 2016-06-22 | 2021-11-23 | Nissan Chemical Corporation | Adhesive containing polydimethyl siloxane |
| WO2018216732A1 (ja) * | 2017-05-24 | 2018-11-29 | 日産化学株式会社 | エポキシ変性ポリシロキサンを含有する仮接着剤 |
| SG11202105574YA (en) * | 2018-11-28 | 2021-06-29 | Nissan Chemical Corp | Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrate |
| WO2020138240A1 (ja) * | 2018-12-27 | 2020-07-02 | 日産化学株式会社 | 光照射剥離用接着剤組成物及び積層体並びに積層体の製造方法及び剥離方法 |
-
2019
- 2019-04-23 US US17/052,223 patent/US12559655B2/en active Active
- 2019-04-23 SG SG11202010863YA patent/SG11202010863YA/en unknown
- 2019-04-23 JP JP2020517050A patent/JP7424969B2/ja active Active
- 2019-04-23 CN CN201980029351.6A patent/CN112074931A/zh active Pending
- 2019-04-23 KR KR1020207031002A patent/KR102799545B1/ko active Active
- 2019-04-23 WO PCT/JP2019/017197 patent/WO2019212008A1/ja not_active Ceased
- 2019-04-23 EP EP19796150.1A patent/EP3790038A4/en active Pending
- 2019-04-26 TW TW114101256A patent/TWI900395B/zh active
- 2019-04-26 TW TW108114686A patent/TWI873093B/zh active
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