JPWO2021193516A5 - - Google Patents
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- Publication number
- JPWO2021193516A5 JPWO2021193516A5 JP2022510471A JP2022510471A JPWO2021193516A5 JP WO2021193516 A5 JPWO2021193516 A5 JP WO2021193516A5 JP 2022510471 A JP2022510471 A JP 2022510471A JP 2022510471 A JP2022510471 A JP 2022510471A JP WO2021193516 A5 JPWO2021193516 A5 JP WO2021193516A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- based adhesives
- adhesive
- formula
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 34
- 230000001070 adhesive effect Effects 0.000 claims 34
- 239000000758 substrate Substances 0.000 claims 26
- 239000004065 semiconductor Substances 0.000 claims 24
- 239000002904 solvent Substances 0.000 claims 12
- 238000004140 cleaning Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 10
- 125000000217 alkyl group Chemical group 0.000 claims 9
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000003960 organic solvent Substances 0.000 claims 9
- 239000012790 adhesive layer Substances 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 3
- 239000004925 Acrylic resin Substances 0.000 claims 3
- 229920000178 Acrylic resin Polymers 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 3
- 239000004793 Polystyrene Substances 0.000 claims 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000003822 epoxy resin Substances 0.000 claims 3
- 238000006459 hydrosilylation reaction Methods 0.000 claims 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 3
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 claims 3
- 239000005011 phenolic resin Substances 0.000 claims 3
- 229920001568 phenolic resin Polymers 0.000 claims 3
- 229920002647 polyamide Polymers 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- 229920002223 polystyrene Polymers 0.000 claims 3
- 150000003839 salts Chemical class 0.000 claims 3
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020050954 | 2020-03-23 | ||
| JP2020050954 | 2020-03-23 | ||
| PCT/JP2021/011675 WO2021193516A1 (ja) | 2020-03-23 | 2021-03-22 | 半導体基板の洗浄方法、加工された半導体基板の製造方法及び剥離用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193516A1 JPWO2021193516A1 (https=) | 2021-09-30 |
| JPWO2021193516A5 true JPWO2021193516A5 (https=) | 2022-12-27 |
| JP7640939B2 JP7640939B2 (ja) | 2025-03-06 |
Family
ID=77891840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022510471A Active JP7640939B2 (ja) | 2020-03-23 | 2021-03-22 | 半導体基板の洗浄方法、加工された半導体基板の製造方法及び剥離用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230131428A1 (https=) |
| EP (1) | EP4131344A4 (https=) |
| JP (1) | JP7640939B2 (https=) |
| KR (1) | KR20220161345A (https=) |
| CN (1) | CN115335970B (https=) |
| TW (1) | TWI910138B (https=) |
| WO (1) | WO2021193516A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119301740A (zh) * | 2022-06-02 | 2025-01-10 | 日产化学株式会社 | 光照射剥离用的粘接剂组合物、层叠体以及经加工的半导体基板的制造方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100271768B1 (ko) * | 1998-06-26 | 2001-02-01 | 윤종용 | 반도체 포토레지스트제거용 용제조성물, 이를 이용한 반도체장치 제조용 웨이퍼의 리워크방법 및 반도체장치의 제조방법 |
| US6818608B2 (en) | 2002-02-01 | 2004-11-16 | John C. Moore | Cured polymers dissolving compositions |
| AU2003207281A1 (en) * | 2002-02-06 | 2003-09-02 | Asahi Kasei Kabushiki Kaisha | Coating compositions for forming insulating thin films |
| US20080139436A1 (en) * | 2006-09-18 | 2008-06-12 | Chris Reid | Two step cleaning process to remove resist, etch residue, and copper oxide from substrates having copper and low-K dielectric material |
| US8614053B2 (en) * | 2009-03-27 | 2013-12-24 | Eastman Chemical Company | Processess and compositions for removing substances from substrates |
| US8309502B2 (en) * | 2009-03-27 | 2012-11-13 | Eastman Chemical Company | Compositions and methods for removing organic substances |
| US8444768B2 (en) * | 2009-03-27 | 2013-05-21 | Eastman Chemical Company | Compositions and methods for removing organic substances |
| JP5010668B2 (ja) * | 2009-12-03 | 2012-08-29 | 信越化学工業株式会社 | 積層型半導体集積装置の製造方法 |
| KR20120132624A (ko) | 2010-02-12 | 2012-12-06 | 다우 코닝 코포레이션 | 반도체 가공을 위한 임시 웨이퍼 접합 방법 |
| US20110253171A1 (en) * | 2010-04-15 | 2011-10-20 | John Moore | Chemical Composition and Methods for Removing Epoxy-Based Photoimageable Coatings Utilized In Microelectronic Fabrication |
| JP5767159B2 (ja) * | 2012-04-27 | 2015-08-19 | 信越化学工業株式会社 | ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法 |
| US9458414B2 (en) * | 2012-09-21 | 2016-10-04 | Gfbiochemicals Limited | Cleaning, surfactant, and personal care compositions |
| JP2014133855A (ja) | 2012-12-11 | 2014-07-24 | Fujifilm Corp | シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法 |
| JP6224509B2 (ja) | 2013-05-14 | 2017-11-01 | 信越化学工業株式会社 | ウエハ用仮接着材料、それらを用いた仮接着用フィルム、及びウエハ加工体並びにそれらを使用した薄型ウエハの製造方法 |
| JP5775231B1 (ja) * | 2013-12-16 | 2015-09-09 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 付加硬化型シリコーン組成物 |
| US10903106B2 (en) * | 2014-06-10 | 2021-01-26 | Nissan Chemical Industries, Ltd. | Layered body of temporary adhesive |
| JP6450451B2 (ja) * | 2015-03-23 | 2019-01-09 | 富士フイルム株式会社 | キットおよび積層体 |
| KR102636988B1 (ko) | 2016-12-09 | 2024-02-15 | 동우 화인켐 주식회사 | 경화 고분자 세정액 조성물 |
| KR102680736B1 (ko) * | 2016-12-14 | 2024-07-03 | 삼성전자주식회사 | 기판 가공 방법 및 접착층 세정 조성물 |
| US20230131533A1 (en) * | 2020-03-23 | 2023-04-27 | Nissan Chemical Corporation | Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition |
-
2021
- 2021-03-22 CN CN202180024051.6A patent/CN115335970B/zh active Active
- 2021-03-22 US US17/914,016 patent/US20230131428A1/en active Pending
- 2021-03-22 EP EP21775766.5A patent/EP4131344A4/en active Pending
- 2021-03-22 JP JP2022510471A patent/JP7640939B2/ja active Active
- 2021-03-22 WO PCT/JP2021/011675 patent/WO2021193516A1/ja not_active Ceased
- 2021-03-22 KR KR1020227034734A patent/KR20220161345A/ko active Pending
- 2021-03-23 TW TW110110435A patent/TWI910138B/zh active
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