JPWO2023042372A5 - - Google Patents

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Publication number
JPWO2023042372A5
JPWO2023042372A5 JP2023548058A JP2023548058A JPWO2023042372A5 JP WO2023042372 A5 JPWO2023042372 A5 JP WO2023042372A5 JP 2023548058 A JP2023548058 A JP 2023548058A JP 2023548058 A JP2023548058 A JP 2023548058A JP WO2023042372 A5 JPWO2023042372 A5 JP WO2023042372A5
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JP
Japan
Prior art keywords
bonding material
lead electrode
semiconductor device
joint
placing
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JP2023548058A
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English (en)
Japanese (ja)
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JPWO2023042372A1 (https=
JP7592180B2 (ja
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Priority claimed from PCT/JP2021/034308 external-priority patent/WO2023042372A1/ja
Publication of JPWO2023042372A1 publication Critical patent/JPWO2023042372A1/ja
Publication of JPWO2023042372A5 publication Critical patent/JPWO2023042372A5/ja
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Publication of JP7592180B2 publication Critical patent/JP7592180B2/ja
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JP2023548058A 2021-09-17 2021-09-17 半導体装置、及び半導体装置の製造方法 Active JP7592180B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/034308 WO2023042372A1 (ja) 2021-09-17 2021-09-17 半導体装置、及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023042372A1 JPWO2023042372A1 (https=) 2023-03-23
JPWO2023042372A5 true JPWO2023042372A5 (https=) 2023-11-28
JP7592180B2 JP7592180B2 (ja) 2024-11-29

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ID=85602596

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JP2023548058A Active JP7592180B2 (ja) 2021-09-17 2021-09-17 半導体装置、及び半導体装置の製造方法

Country Status (5)

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US (1) US20240321720A1 (https=)
JP (1) JP7592180B2 (https=)
CN (1) CN117957649A (https=)
DE (1) DE112021008238T5 (https=)
WO (1) WO2023042372A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1318545A1 (de) 2001-12-06 2003-06-11 Abb Research Ltd. Leistungshalbleiter-Submodul und Leistungshalbleiter-Modul
JP4985012B2 (ja) * 2007-03-22 2012-07-25 富士電機株式会社 半導体装置およびその製造方法
JP2012059876A (ja) 2010-09-08 2012-03-22 Sanken Electric Co Ltd 半導体モジュール及びその製造方法
JP5929694B2 (ja) 2012-10-15 2016-06-08 株式会社豊田自動織機 半導体装置
US9673118B2 (en) 2013-11-26 2017-06-06 Mitsubishi Electric Corporation Power module and method of manufacturing power module
DE112017007415B4 (de) * 2017-04-06 2023-01-12 Mitsubishi Electric Corporation Halbleiterbauelement, Verfahren zur Herstellung desselben und Leistungswandlervorrichtung
JP7190985B2 (ja) * 2019-08-05 2022-12-16 三菱電機株式会社 半導体装置
JP7229384B2 (ja) 2019-10-17 2023-02-27 三菱電機株式会社 半導体装置および半導体装置の製造方法

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