JPWO2020175684A5 - - Google Patents
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- Publication number
- JPWO2020175684A5 JPWO2020175684A5 JP2021502652A JP2021502652A JPWO2020175684A5 JP WO2020175684 A5 JPWO2020175684 A5 JP WO2020175684A5 JP 2021502652 A JP2021502652 A JP 2021502652A JP 2021502652 A JP2021502652 A JP 2021502652A JP WO2020175684 A5 JPWO2020175684 A5 JP WO2020175684A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- substrate
- manufacturing
- supporting substrate
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 28
- 239000004065 semiconductor Substances 0.000 claims 27
- 238000004519 manufacturing process Methods 0.000 claims 10
- 239000013078 crystal Substances 0.000 claims 2
- 239000012141 concentrate Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019036097 | 2019-02-28 | ||
| JP2019036097 | 2019-02-28 | ||
| PCT/JP2020/008399 WO2020175684A1 (ja) | 2019-02-28 | 2020-02-28 | 半導体素子の製造方法および半導体素子体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020175684A1 JPWO2020175684A1 (https=) | 2020-09-03 |
| JPWO2020175684A5 true JPWO2020175684A5 (https=) | 2022-07-28 |
| JP7267394B2 JP7267394B2 (ja) | 2023-05-01 |
Family
ID=72239807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021502652A Active JP7267394B2 (ja) | 2019-02-28 | 2020-02-28 | 半導体素子の製造方法および半導体素子体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12132142B2 (https=) |
| EP (1) | EP3933886B1 (https=) |
| JP (1) | JP7267394B2 (https=) |
| CN (2) | CN113490995B (https=) |
| WO (1) | WO2020175684A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7854514B2 (ja) * | 2022-12-05 | 2026-05-01 | 京セラ株式会社 | 半導体素子の製造方法および製造装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4638958B1 (https=) | 1962-03-20 | 1971-11-16 | ||
| JP4731180B2 (ja) * | 2005-02-21 | 2011-07-20 | 三洋電機株式会社 | 窒化物系半導体素子の製造方法 |
| JP2007096114A (ja) | 2005-09-29 | 2007-04-12 | Sanyo Electric Co Ltd | 半導体発光素子及び半導体発光素子の製造方法 |
| JP5070247B2 (ja) * | 2009-06-23 | 2012-11-07 | 株式会社沖データ | 半導体装置の製造方法、及び半導体装置 |
| JP4638958B1 (ja) * | 2009-08-20 | 2011-02-23 | 株式会社パウデック | 半導体素子の製造方法 |
| JP5466479B2 (ja) * | 2009-10-27 | 2014-04-09 | スタンレー電気株式会社 | 半導体素子の製造方法 |
| WO2015160909A1 (en) * | 2014-04-16 | 2015-10-22 | Yale University | Method of obtaining planar semipolar gallium nitride surfaces |
| US20230260943A1 (en) * | 2022-02-17 | 2023-08-17 | Micron Technology, Inc. | Semiconductor die assemblies with flexible interconnects and associated methods and systems |
-
2020
- 2020-02-28 CN CN202080016757.3A patent/CN113490995B/zh active Active
- 2020-02-28 CN CN202510136611.7A patent/CN120015705A/zh active Pending
- 2020-02-28 JP JP2021502652A patent/JP7267394B2/ja active Active
- 2020-02-28 US US17/434,253 patent/US12132142B2/en active Active
- 2020-02-28 EP EP20762528.6A patent/EP3933886B1/en active Active
- 2020-02-28 WO PCT/JP2020/008399 patent/WO2020175684A1/ja not_active Ceased
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