JPWO2023042372A1 - - Google Patents
Info
- Publication number
- JPWO2023042372A1 JPWO2023042372A1 JP2023548058A JP2023548058A JPWO2023042372A1 JP WO2023042372 A1 JPWO2023042372 A1 JP WO2023042372A1 JP 2023548058 A JP2023548058 A JP 2023548058A JP 2023548058 A JP2023548058 A JP 2023548058A JP WO2023042372 A1 JPWO2023042372 A1 JP WO2023042372A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
- H10W76/42—Fillings
- H10W76/47—Solid or gel fillings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/034308 WO2023042372A1 (ja) | 2021-09-17 | 2021-09-17 | 半導体装置、及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042372A1 true JPWO2023042372A1 (https=) | 2023-03-23 |
| JPWO2023042372A5 JPWO2023042372A5 (https=) | 2023-11-28 |
| JP7592180B2 JP7592180B2 (ja) | 2024-11-29 |
Family
ID=85602596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023548058A Active JP7592180B2 (ja) | 2021-09-17 | 2021-09-17 | 半導体装置、及び半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240321720A1 (https=) |
| JP (1) | JP7592180B2 (https=) |
| CN (1) | CN117957649A (https=) |
| DE (1) | DE112021008238T5 (https=) |
| WO (1) | WO2023042372A1 (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197861A (ja) * | 2001-12-06 | 2003-07-11 | Abb Res Ltd | 電力用半導体サブモジュール及び電力用半導体モジュール |
| JP2008235651A (ja) * | 2007-03-22 | 2008-10-02 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
| JP2012059876A (ja) * | 2010-09-08 | 2012-03-22 | Sanken Electric Co Ltd | 半導体モジュール及びその製造方法 |
| JP2014082275A (ja) * | 2012-10-15 | 2014-05-08 | Toyota Industries Corp | 半導体装置 |
| WO2015079600A1 (ja) * | 2013-11-26 | 2015-06-04 | 三菱電機株式会社 | パワーモジュール、及びパワーモジュールの製造方法 |
| WO2018185974A1 (ja) * | 2017-04-06 | 2018-10-11 | 三菱電機株式会社 | 半導体装置およびその製造方法、ならびに電力変換装置 |
| WO2021075016A1 (ja) * | 2019-10-17 | 2021-04-22 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7190985B2 (ja) * | 2019-08-05 | 2022-12-16 | 三菱電機株式会社 | 半導体装置 |
-
2021
- 2021-09-17 US US18/577,884 patent/US20240321720A1/en active Pending
- 2021-09-17 WO PCT/JP2021/034308 patent/WO2023042372A1/ja not_active Ceased
- 2021-09-17 JP JP2023548058A patent/JP7592180B2/ja active Active
- 2021-09-17 DE DE112021008238.8T patent/DE112021008238T5/de active Pending
- 2021-09-17 CN CN202180102301.3A patent/CN117957649A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197861A (ja) * | 2001-12-06 | 2003-07-11 | Abb Res Ltd | 電力用半導体サブモジュール及び電力用半導体モジュール |
| JP2008235651A (ja) * | 2007-03-22 | 2008-10-02 | Fuji Electric Device Technology Co Ltd | 半導体装置およびその製造方法 |
| JP2012059876A (ja) * | 2010-09-08 | 2012-03-22 | Sanken Electric Co Ltd | 半導体モジュール及びその製造方法 |
| JP2014082275A (ja) * | 2012-10-15 | 2014-05-08 | Toyota Industries Corp | 半導体装置 |
| WO2015079600A1 (ja) * | 2013-11-26 | 2015-06-04 | 三菱電機株式会社 | パワーモジュール、及びパワーモジュールの製造方法 |
| WO2018185974A1 (ja) * | 2017-04-06 | 2018-10-11 | 三菱電機株式会社 | 半導体装置およびその製造方法、ならびに電力変換装置 |
| WO2021075016A1 (ja) * | 2019-10-17 | 2021-04-22 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021008238T5 (de) | 2024-07-11 |
| CN117957649A (zh) | 2024-04-30 |
| JP7592180B2 (ja) | 2024-11-29 |
| US20240321720A1 (en) | 2024-09-26 |
| WO2023042372A1 (ja) | 2023-03-23 |
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