JPWO2023037852A5 - - Google Patents

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Publication number
JPWO2023037852A5
JPWO2023037852A5 JP2023546863A JP2023546863A JPWO2023037852A5 JP WO2023037852 A5 JPWO2023037852 A5 JP WO2023037852A5 JP 2023546863 A JP2023546863 A JP 2023546863A JP 2023546863 A JP2023546863 A JP 2023546863A JP WO2023037852 A5 JPWO2023037852 A5 JP WO2023037852A5
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JP
Japan
Prior art keywords
signal conductor
interlayer connection
connection conductors
viewed
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023546863A
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English (en)
Japanese (ja)
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JPWO2023037852A1 (https=
JP7525071B2 (ja
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Publication date
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Priority claimed from PCT/JP2022/031488 external-priority patent/WO2023037852A1/ja
Publication of JPWO2023037852A1 publication Critical patent/JPWO2023037852A1/ja
Publication of JPWO2023037852A5 publication Critical patent/JPWO2023037852A5/ja
Application granted granted Critical
Publication of JP7525071B2 publication Critical patent/JP7525071B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023546863A 2021-09-07 2022-08-22 多層基板 Active JP7525071B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021145148 2021-09-07
JP2021145148 2021-09-07
PCT/JP2022/031488 WO2023037852A1 (ja) 2021-09-07 2022-08-22 多層基板

Publications (3)

Publication Number Publication Date
JPWO2023037852A1 JPWO2023037852A1 (https=) 2023-03-16
JPWO2023037852A5 true JPWO2023037852A5 (https=) 2024-02-09
JP7525071B2 JP7525071B2 (ja) 2024-07-30

Family

ID=85506550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023546863A Active JP7525071B2 (ja) 2021-09-07 2022-08-22 多層基板

Country Status (4)

Country Link
US (1) US12439505B2 (https=)
JP (1) JP7525071B2 (https=)
CN (1) CN221429166U (https=)
WO (1) WO2023037852A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025074806A1 (ja) * 2023-10-04 2025-04-10 株式会社村田製作所 多層基板
WO2025126852A1 (ja) * 2023-12-11 2025-06-19 株式会社村田製作所 多層基板
WO2025126853A1 (ja) * 2023-12-11 2025-06-19 株式会社村田製作所 多層基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603022Y2 (ja) * 1990-04-25 2000-02-14 株式会社アドバンテスト プリント基板伝送路
US5408053A (en) * 1993-11-30 1995-04-18 Hughes Aircraft Company Layered planar transmission lines
JP3314594B2 (ja) * 1995-09-22 2002-08-12 松下電器産業株式会社 高周波回路用電極及びこれを用いた伝送線路、共振器
JP3255118B2 (ja) * 1998-08-04 2002-02-12 株式会社村田製作所 伝送線路および伝送線路共振器
GB0114818D0 (en) * 2001-06-18 2001-08-08 Nokia Corp Conductor structure
EP2244331A1 (en) * 2009-04-22 2010-10-27 Nxp B.V. Planar waveguide
JP5881400B2 (ja) * 2011-12-13 2016-03-09 三菱電機株式会社 高周波伝送線路
WO2014057761A1 (ja) 2012-10-12 2014-04-17 株式会社村田製作所 高周波信号線路
JP2016081999A (ja) * 2014-10-14 2016-05-16 富士通株式会社 回路基板及び電子装置
WO2020217971A1 (ja) * 2019-04-24 2020-10-29 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置
WO2021131285A1 (ja) * 2019-12-26 2021-07-01 株式会社村田製作所 アンテナモジュールおよびそれを搭載する通信装置

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