CN221429166U - 多层基板 - Google Patents

多层基板 Download PDF

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Publication number
CN221429166U
CN221429166U CN202290000493.7U CN202290000493U CN221429166U CN 221429166 U CN221429166 U CN 221429166U CN 202290000493 U CN202290000493 U CN 202290000493U CN 221429166 U CN221429166 U CN 221429166U
Authority
CN
China
Prior art keywords
conductor
signal conductor
signal
multilayer substrate
interlayer connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202290000493.7U
Other languages
English (en)
Chinese (zh)
Inventor
寺西庆祐
藤井洋隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN221429166U publication Critical patent/CN221429166U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
CN202290000493.7U 2021-09-07 2022-08-22 多层基板 Active CN221429166U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021145148 2021-09-07
JP2021-145148 2021-09-07
PCT/JP2022/031488 WO2023037852A1 (ja) 2021-09-07 2022-08-22 多層基板

Publications (1)

Publication Number Publication Date
CN221429166U true CN221429166U (zh) 2024-07-26

Family

ID=85506550

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202290000493.7U Active CN221429166U (zh) 2021-09-07 2022-08-22 多层基板

Country Status (4)

Country Link
US (1) US12439505B2 (https=)
JP (1) JP7525071B2 (https=)
CN (1) CN221429166U (https=)
WO (1) WO2023037852A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025074806A1 (ja) * 2023-10-04 2025-04-10 株式会社村田製作所 多層基板
WO2025126852A1 (ja) * 2023-12-11 2025-06-19 株式会社村田製作所 多層基板
WO2025126853A1 (ja) * 2023-12-11 2025-06-19 株式会社村田製作所 多層基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2603022Y2 (ja) * 1990-04-25 2000-02-14 株式会社アドバンテスト プリント基板伝送路
US5408053A (en) * 1993-11-30 1995-04-18 Hughes Aircraft Company Layered planar transmission lines
JP3314594B2 (ja) * 1995-09-22 2002-08-12 松下電器産業株式会社 高周波回路用電極及びこれを用いた伝送線路、共振器
JP3255118B2 (ja) * 1998-08-04 2002-02-12 株式会社村田製作所 伝送線路および伝送線路共振器
GB0114818D0 (en) * 2001-06-18 2001-08-08 Nokia Corp Conductor structure
EP2244331A1 (en) * 2009-04-22 2010-10-27 Nxp B.V. Planar waveguide
JP5881400B2 (ja) * 2011-12-13 2016-03-09 三菱電機株式会社 高周波伝送線路
WO2014057761A1 (ja) 2012-10-12 2014-04-17 株式会社村田製作所 高周波信号線路
JP2016081999A (ja) * 2014-10-14 2016-05-16 富士通株式会社 回路基板及び電子装置
WO2020217971A1 (ja) * 2019-04-24 2020-10-29 株式会社村田製作所 アンテナモジュールおよびそれを搭載した通信装置
WO2021131285A1 (ja) * 2019-12-26 2021-07-01 株式会社村田製作所 アンテナモジュールおよびそれを搭載する通信装置

Also Published As

Publication number Publication date
WO2023037852A1 (ja) 2023-03-16
US20240064890A1 (en) 2024-02-22
US12439505B2 (en) 2025-10-07
JPWO2023037852A1 (https=) 2023-03-16
JP7525071B2 (ja) 2024-07-30

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