JPWO2023032860A5 - - Google Patents
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- Publication number
- JPWO2023032860A5 JPWO2023032860A5 JP2023545532A JP2023545532A JPWO2023032860A5 JP WO2023032860 A5 JPWO2023032860 A5 JP WO2023032860A5 JP 2023545532 A JP2023545532 A JP 2023545532A JP 2023545532 A JP2023545532 A JP 2023545532A JP WO2023032860 A5 JPWO2023032860 A5 JP WO2023032860A5
- Authority
- JP
- Japan
- Prior art keywords
- tan
- resin composition
- curable resin
- composition according
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 238000005259 measurement Methods 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021140407 | 2021-08-30 | ||
| PCT/JP2022/032271 WO2023032860A1 (ja) | 2021-08-30 | 2022-08-26 | 硬化性樹脂組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032860A1 JPWO2023032860A1 (https=) | 2023-03-09 |
| JPWO2023032860A5 true JPWO2023032860A5 (https=) | 2024-05-23 |
Family
ID=85412723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545532A Pending JPWO2023032860A1 (https=) | 2021-08-30 | 2022-08-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023032860A1 (https=) |
| CN (1) | CN117858924A (https=) |
| TW (1) | TW202313838A (https=) |
| WO (1) | WO2023032860A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06200121A (ja) * | 1993-01-06 | 1994-07-19 | Nippon Steel Chem Co Ltd | 半導体封止用低圧トランスファ成形材料 |
| KR101557538B1 (ko) * | 2012-12-24 | 2015-10-06 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
| KR101557537B1 (ko) * | 2012-12-24 | 2015-10-06 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
| JP7302598B2 (ja) * | 2018-06-12 | 2023-07-04 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
| JP7322368B2 (ja) * | 2018-09-14 | 2023-08-08 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
| JP7484081B2 (ja) * | 2018-10-18 | 2024-05-16 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
| JP7269579B2 (ja) * | 2018-10-19 | 2023-05-09 | 株式会社レゾナック | エポキシ樹脂組成物及び電子部品装置 |
| WO2021075207A1 (ja) * | 2019-10-16 | 2021-04-22 | 昭和電工マテリアルズ株式会社 | エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法 |
-
2022
- 2022-08-26 JP JP2023545532A patent/JPWO2023032860A1/ja active Pending
- 2022-08-26 TW TW111132328A patent/TW202313838A/zh unknown
- 2022-08-26 CN CN202280057840.4A patent/CN117858924A/zh active Pending
- 2022-08-26 WO PCT/JP2022/032271 patent/WO2023032860A1/ja not_active Ceased
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