TW202313838A - 硬化性樹脂組成物及電子零件裝置 - Google Patents

硬化性樹脂組成物及電子零件裝置 Download PDF

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Publication number
TW202313838A
TW202313838A TW111132328A TW111132328A TW202313838A TW 202313838 A TW202313838 A TW 202313838A TW 111132328 A TW111132328 A TW 111132328A TW 111132328 A TW111132328 A TW 111132328A TW 202313838 A TW202313838 A TW 202313838A
Authority
TW
Taiwan
Prior art keywords
resin composition
curable resin
temperature
mass
tan
Prior art date
Application number
TW111132328A
Other languages
English (en)
Chinese (zh)
Inventor
姜東哲
畠山恵一
西山智雄
山本貴耶
金貴和
横倉亜唯
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202313838A publication Critical patent/TW202313838A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111132328A 2021-08-30 2022-08-26 硬化性樹脂組成物及電子零件裝置 TW202313838A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-140407 2021-08-30
JP2021140407 2021-08-30

Publications (1)

Publication Number Publication Date
TW202313838A true TW202313838A (zh) 2023-04-01

Family

ID=85412723

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111132328A TW202313838A (zh) 2021-08-30 2022-08-26 硬化性樹脂組成物及電子零件裝置

Country Status (4)

Country Link
JP (1) JPWO2023032860A1 (https=)
CN (1) CN117858924A (https=)
TW (1) TW202313838A (https=)
WO (1) WO2023032860A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200121A (ja) * 1993-01-06 1994-07-19 Nippon Steel Chem Co Ltd 半導体封止用低圧トランスファ成形材料
KR101557538B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR101557537B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP7302598B2 (ja) * 2018-06-12 2023-07-04 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7322368B2 (ja) * 2018-09-14 2023-08-08 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7484081B2 (ja) * 2018-10-18 2024-05-16 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7269579B2 (ja) * 2018-10-19 2023-05-09 株式会社レゾナック エポキシ樹脂組成物及び電子部品装置
WO2021075207A1 (ja) * 2019-10-16 2021-04-22 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Also Published As

Publication number Publication date
WO2023032860A1 (ja) 2023-03-09
JPWO2023032860A1 (https=) 2023-03-09
CN117858924A (zh) 2024-04-09

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