CN117858924A - 硬化性树脂组合物及电子零件装置 - Google Patents

硬化性树脂组合物及电子零件装置 Download PDF

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Publication number
CN117858924A
CN117858924A CN202280057840.4A CN202280057840A CN117858924A CN 117858924 A CN117858924 A CN 117858924A CN 202280057840 A CN202280057840 A CN 202280057840A CN 117858924 A CN117858924 A CN 117858924A
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CN
China
Prior art keywords
resin composition
curable resin
group
tan
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280057840.4A
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English (en)
Chinese (zh)
Inventor
姜东哲
畠山恵一
西山智雄
山本贵耶
金贵和
横仓亚唯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN117858924A publication Critical patent/CN117858924A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280057840.4A 2021-08-30 2022-08-26 硬化性树脂组合物及电子零件装置 Pending CN117858924A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-140407 2021-08-30
JP2021140407 2021-08-30
PCT/JP2022/032271 WO2023032860A1 (ja) 2021-08-30 2022-08-26 硬化性樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
CN117858924A true CN117858924A (zh) 2024-04-09

Family

ID=85412723

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280057840.4A Pending CN117858924A (zh) 2021-08-30 2022-08-26 硬化性树脂组合物及电子零件装置

Country Status (4)

Country Link
JP (1) JPWO2023032860A1 (https=)
CN (1) CN117858924A (https=)
TW (1) TW202313838A (https=)
WO (1) WO2023032860A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200121A (ja) * 1993-01-06 1994-07-19 Nippon Steel Chem Co Ltd 半導体封止用低圧トランスファ成形材料
KR101557538B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
KR101557537B1 (ko) * 2012-12-24 2015-10-06 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP7302598B2 (ja) * 2018-06-12 2023-07-04 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7322368B2 (ja) * 2018-09-14 2023-08-08 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7484081B2 (ja) * 2018-10-18 2024-05-16 株式会社レゾナック 硬化性樹脂組成物及び電子部品装置
JP7269579B2 (ja) * 2018-10-19 2023-05-09 株式会社レゾナック エポキシ樹脂組成物及び電子部品装置
WO2021075207A1 (ja) * 2019-10-16 2021-04-22 昭和電工マテリアルズ株式会社 エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法

Also Published As

Publication number Publication date
WO2023032860A1 (ja) 2023-03-09
JPWO2023032860A1 (https=) 2023-03-09
TW202313838A (zh) 2023-04-01

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