JPWO2023032860A1 - - Google Patents
Info
- Publication number
- JPWO2023032860A1 JPWO2023032860A1 JP2023545532A JP2023545532A JPWO2023032860A1 JP WO2023032860 A1 JPWO2023032860 A1 JP WO2023032860A1 JP 2023545532 A JP2023545532 A JP 2023545532A JP 2023545532 A JP2023545532 A JP 2023545532A JP WO2023032860 A1 JPWO2023032860 A1 JP WO2023032860A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021140407 | 2021-08-30 | ||
| PCT/JP2022/032271 WO2023032860A1 (ja) | 2021-08-30 | 2022-08-26 | 硬化性樹脂組成物及び電子部品装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032860A1 true JPWO2023032860A1 (https=) | 2023-03-09 |
| JPWO2023032860A5 JPWO2023032860A5 (https=) | 2024-05-23 |
Family
ID=85412723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545532A Pending JPWO2023032860A1 (https=) | 2021-08-30 | 2022-08-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023032860A1 (https=) |
| CN (1) | CN117858924A (https=) |
| TW (1) | TW202313838A (https=) |
| WO (1) | WO2023032860A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06200121A (ja) * | 1993-01-06 | 1994-07-19 | Nippon Steel Chem Co Ltd | 半導体封止用低圧トランスファ成形材料 |
| KR101557538B1 (ko) * | 2012-12-24 | 2015-10-06 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
| KR101557537B1 (ko) * | 2012-12-24 | 2015-10-06 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
| JP7302598B2 (ja) * | 2018-06-12 | 2023-07-04 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
| JP7322368B2 (ja) * | 2018-09-14 | 2023-08-08 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
| JP7484081B2 (ja) * | 2018-10-18 | 2024-05-16 | 株式会社レゾナック | 硬化性樹脂組成物及び電子部品装置 |
| JP7269579B2 (ja) * | 2018-10-19 | 2023-05-09 | 株式会社レゾナック | エポキシ樹脂組成物及び電子部品装置 |
| WO2021075207A1 (ja) * | 2019-10-16 | 2021-04-22 | 昭和電工マテリアルズ株式会社 | エポキシ樹脂組成物、電子部品装置、及び電子部品装置の製造方法 |
-
2022
- 2022-08-26 JP JP2023545532A patent/JPWO2023032860A1/ja active Pending
- 2022-08-26 TW TW111132328A patent/TW202313838A/zh unknown
- 2022-08-26 CN CN202280057840.4A patent/CN117858924A/zh active Pending
- 2022-08-26 WO PCT/JP2022/032271 patent/WO2023032860A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023032860A1 (ja) | 2023-03-09 |
| TW202313838A (zh) | 2023-04-01 |
| CN117858924A (zh) | 2024-04-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240202 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250717 |