JPWO2023021952A5 - - Google Patents

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Publication number
JPWO2023021952A5
JPWO2023021952A5 JP2023542300A JP2023542300A JPWO2023021952A5 JP WO2023021952 A5 JPWO2023021952 A5 JP WO2023021952A5 JP 2023542300 A JP2023542300 A JP 2023542300A JP 2023542300 A JP2023542300 A JP 2023542300A JP WO2023021952 A5 JPWO2023021952 A5 JP WO2023021952A5
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JP
Japan
Prior art keywords
substrate
laser light
laser
absorbing film
area
Prior art date
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JP2023542300A
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English (en)
Japanese (ja)
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JPWO2023021952A1 (https=
JP7678881B2 (ja
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Priority claimed from PCT/JP2022/029027 external-priority patent/WO2023021952A1/ja
Publication of JPWO2023021952A1 publication Critical patent/JPWO2023021952A1/ja
Publication of JPWO2023021952A5 publication Critical patent/JPWO2023021952A5/ja
Priority to JP2025076594A priority Critical patent/JP2025105952A/ja
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Publication of JP7678881B2 publication Critical patent/JP7678881B2/ja
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JP2023542300A 2021-08-16 2022-07-27 処理方法及び処理システム Active JP7678881B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025076594A JP2025105952A (ja) 2021-08-16 2025-05-02 処理方法及び処理システム

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021132199 2021-08-16
JP2021132199 2021-08-16
JP2021199502 2021-12-08
JP2021199502 2021-12-08
PCT/JP2022/029027 WO2023021952A1 (ja) 2021-08-16 2022-07-27 処理方法及び処理システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025076594A Division JP2025105952A (ja) 2021-08-16 2025-05-02 処理方法及び処理システム

Publications (3)

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JPWO2023021952A1 JPWO2023021952A1 (https=) 2023-02-23
JPWO2023021952A5 true JPWO2023021952A5 (https=) 2024-05-02
JP7678881B2 JP7678881B2 (ja) 2025-05-16

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ID=85240587

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JP2023542300A Active JP7678881B2 (ja) 2021-08-16 2022-07-27 処理方法及び処理システム
JP2025076594A Pending JP2025105952A (ja) 2021-08-16 2025-05-02 処理方法及び処理システム

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JP2025076594A Pending JP2025105952A (ja) 2021-08-16 2025-05-02 処理方法及び処理システム

Country Status (4)

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JP (2) JP7678881B2 (https=)
KR (1) KR20240043781A (https=)
TW (1) TW202314842A (https=)
WO (1) WO2023021952A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116364636B (zh) * 2023-05-31 2023-07-28 广东鸿浩半导体设备有限公司 一种基于红外成像辅助的激光解键合方法
WO2026079048A1 (ja) * 2024-10-09 2026-04-16 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004111606A (ja) 2002-09-18 2004-04-08 Tokyo Seimitsu Co Ltd ウェーハの加工方法
WO2013126927A2 (en) * 2012-02-26 2013-08-29 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
KR20260047323A (ko) 2018-03-14 2026-04-07 도쿄엘렉트론가부시키가이샤 기판 가공 장치 및 기판 가공 방법
JP7242362B2 (ja) 2019-03-18 2023-03-20 キオクシア株式会社 半導体装置の製造方法
TWI877184B (zh) 2019-07-18 2025-03-21 日商東京威力科創股份有限公司 處理裝置及處理方法
JP2021068869A (ja) * 2019-10-28 2021-04-30 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP7386075B2 (ja) 2019-12-25 2023-11-24 東京エレクトロン株式会社 基板処理方法及び基板処理システム
KR20260004590A (ko) * 2019-12-26 2026-01-08 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 장치 및 기판 처리 시스템

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