KR20240043781A - 처리 방법 및 처리 시스템 - Google Patents

처리 방법 및 처리 시스템 Download PDF

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Publication number
KR20240043781A
KR20240043781A KR1020247007471A KR20247007471A KR20240043781A KR 20240043781 A KR20240043781 A KR 20240043781A KR 1020247007471 A KR1020247007471 A KR 1020247007471A KR 20247007471 A KR20247007471 A KR 20247007471A KR 20240043781 A KR20240043781 A KR 20240043781A
Authority
KR
South Korea
Prior art keywords
substrate
laser
wafer
laser light
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247007471A
Other languages
English (en)
Korean (ko)
Inventor
하야토 타노우에
요헤이 야마시타
야스타카 미조모토
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240043781A publication Critical patent/KR20240043781A/ko
Pending legal-status Critical Current

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Classifications

    • H01L21/304—
    • H01L21/67028—
    • H01L21/6773—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020247007471A 2021-08-16 2022-07-27 처리 방법 및 처리 시스템 Pending KR20240043781A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2021-132199 2021-08-16
JP2021132199 2021-08-16
JP2021199502 2021-12-08
JPJP-P-2021-199502 2021-12-08
PCT/JP2022/029027 WO2023021952A1 (ja) 2021-08-16 2022-07-27 処理方法及び処理システム

Publications (1)

Publication Number Publication Date
KR20240043781A true KR20240043781A (ko) 2024-04-03

Family

ID=85240587

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247007471A Pending KR20240043781A (ko) 2021-08-16 2022-07-27 처리 방법 및 처리 시스템

Country Status (4)

Country Link
JP (2) JP7678881B2 (https=)
KR (1) KR20240043781A (https=)
TW (1) TW202314842A (https=)
WO (1) WO2023021952A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116364636B (zh) * 2023-05-31 2023-07-28 广东鸿浩半导体设备有限公司 一种基于红外成像辅助的激光解键合方法
WO2026079048A1 (ja) * 2024-10-09 2026-04-16 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019176589A1 (ja) 2018-03-14 2019-09-19 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004111606A (ja) 2002-09-18 2004-04-08 Tokyo Seimitsu Co Ltd ウェーハの加工方法
WO2013126927A2 (en) * 2012-02-26 2013-08-29 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
JP7242362B2 (ja) 2019-03-18 2023-03-20 キオクシア株式会社 半導体装置の製造方法
TWI877184B (zh) 2019-07-18 2025-03-21 日商東京威力科創股份有限公司 處理裝置及處理方法
JP2021068869A (ja) * 2019-10-28 2021-04-30 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP7386075B2 (ja) 2019-12-25 2023-11-24 東京エレクトロン株式会社 基板処理方法及び基板処理システム
KR20260004590A (ko) * 2019-12-26 2026-01-08 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 장치 및 기판 처리 시스템

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019176589A1 (ja) 2018-03-14 2019-09-19 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
TW202314842A (zh) 2023-04-01
JP2025105952A (ja) 2025-07-10
JPWO2023021952A1 (https=) 2023-02-23
JP7678881B2 (ja) 2025-05-16
WO2023021952A1 (ja) 2023-02-23

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