JPWO2023021952A1 - - Google Patents
Info
- Publication number
- JPWO2023021952A1 JPWO2023021952A1 JP2023542300A JP2023542300A JPWO2023021952A1 JP WO2023021952 A1 JPWO2023021952 A1 JP WO2023021952A1 JP 2023542300 A JP2023542300 A JP 2023542300A JP 2023542300 A JP2023542300 A JP 2023542300A JP WO2023021952 A1 JPWO2023021952 A1 JP WO2023021952A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025076594A JP2025105952A (ja) | 2021-08-16 | 2025-05-02 | 処理方法及び処理システム |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021132199 | 2021-08-16 | ||
| JP2021132199 | 2021-08-16 | ||
| JP2021199502 | 2021-12-08 | ||
| JP2021199502 | 2021-12-08 | ||
| PCT/JP2022/029027 WO2023021952A1 (ja) | 2021-08-16 | 2022-07-27 | 処理方法及び処理システム |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025076594A Division JP2025105952A (ja) | 2021-08-16 | 2025-05-02 | 処理方法及び処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023021952A1 true JPWO2023021952A1 (https=) | 2023-02-23 |
| JPWO2023021952A5 JPWO2023021952A5 (https=) | 2024-05-02 |
| JP7678881B2 JP7678881B2 (ja) | 2025-05-16 |
Family
ID=85240587
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023542300A Active JP7678881B2 (ja) | 2021-08-16 | 2022-07-27 | 処理方法及び処理システム |
| JP2025076594A Pending JP2025105952A (ja) | 2021-08-16 | 2025-05-02 | 処理方法及び処理システム |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025076594A Pending JP2025105952A (ja) | 2021-08-16 | 2025-05-02 | 処理方法及び処理システム |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7678881B2 (https=) |
| KR (1) | KR20240043781A (https=) |
| TW (1) | TW202314842A (https=) |
| WO (1) | WO2023021952A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116364636B (zh) * | 2023-05-31 | 2023-07-28 | 广东鸿浩半导体设备有限公司 | 一种基于红外成像辅助的激光解键合方法 |
| WO2026079048A1 (ja) * | 2024-10-09 | 2026-04-16 | 東京エレクトロン株式会社 | 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004111606A (ja) * | 2002-09-18 | 2004-04-08 | Tokyo Seimitsu Co Ltd | ウェーハの加工方法 |
| JP2020155493A (ja) * | 2019-03-18 | 2020-09-24 | キオクシア株式会社 | 半導体装置の製造方法および半導体装置 |
| WO2021010287A1 (ja) * | 2019-07-18 | 2021-01-21 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| JP2021068869A (ja) * | 2019-10-28 | 2021-04-30 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| WO2021131711A1 (ja) * | 2019-12-26 | 2021-07-01 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2021103725A (ja) * | 2019-12-25 | 2021-07-15 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013126927A2 (en) * | 2012-02-26 | 2013-08-29 | Solexel, Inc. | Systems and methods for laser splitting and device layer transfer |
| KR20260047323A (ko) | 2018-03-14 | 2026-04-07 | 도쿄엘렉트론가부시키가이샤 | 기판 가공 장치 및 기판 가공 방법 |
-
2022
- 2022-07-27 JP JP2023542300A patent/JP7678881B2/ja active Active
- 2022-07-27 KR KR1020247007471A patent/KR20240043781A/ko active Pending
- 2022-07-27 WO PCT/JP2022/029027 patent/WO2023021952A1/ja not_active Ceased
- 2022-08-08 TW TW111129669A patent/TW202314842A/zh unknown
-
2025
- 2025-05-02 JP JP2025076594A patent/JP2025105952A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004111606A (ja) * | 2002-09-18 | 2004-04-08 | Tokyo Seimitsu Co Ltd | ウェーハの加工方法 |
| JP2020155493A (ja) * | 2019-03-18 | 2020-09-24 | キオクシア株式会社 | 半導体装置の製造方法および半導体装置 |
| WO2021010287A1 (ja) * | 2019-07-18 | 2021-01-21 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
| JP2021068869A (ja) * | 2019-10-28 | 2021-04-30 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| JP2021103725A (ja) * | 2019-12-25 | 2021-07-15 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| WO2021131711A1 (ja) * | 2019-12-26 | 2021-07-01 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202314842A (zh) | 2023-04-01 |
| JP2025105952A (ja) | 2025-07-10 |
| KR20240043781A (ko) | 2024-04-03 |
| JP7678881B2 (ja) | 2025-05-16 |
| WO2023021952A1 (ja) | 2023-02-23 |
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