TW202314842A - 處理方法及處理系統 - Google Patents

處理方法及處理系統 Download PDF

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Publication number
TW202314842A
TW202314842A TW111129669A TW111129669A TW202314842A TW 202314842 A TW202314842 A TW 202314842A TW 111129669 A TW111129669 A TW 111129669A TW 111129669 A TW111129669 A TW 111129669A TW 202314842 A TW202314842 A TW 202314842A
Authority
TW
Taiwan
Prior art keywords
substrate
laser light
laser
wafer
interface
Prior art date
Application number
TW111129669A
Other languages
English (en)
Chinese (zh)
Inventor
田之上隼斗
山下陽平
溝本康隆
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202314842A publication Critical patent/TW202314842A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW111129669A 2021-08-16 2022-08-08 處理方法及處理系統 TW202314842A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-132199 2021-08-16
JP2021132199 2021-08-16
JP2021199502 2021-12-08
JP2021-199502 2021-12-08

Publications (1)

Publication Number Publication Date
TW202314842A true TW202314842A (zh) 2023-04-01

Family

ID=85240587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111129669A TW202314842A (zh) 2021-08-16 2022-08-08 處理方法及處理系統

Country Status (4)

Country Link
JP (2) JP7678881B2 (https=)
KR (1) KR20240043781A (https=)
TW (1) TW202314842A (https=)
WO (1) WO2023021952A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116364636B (zh) * 2023-05-31 2023-07-28 广东鸿浩半导体设备有限公司 一种基于红外成像辅助的激光解键合方法
WO2026079048A1 (ja) * 2024-10-09 2026-04-16 東京エレクトロン株式会社 基板処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004111606A (ja) 2002-09-18 2004-04-08 Tokyo Seimitsu Co Ltd ウェーハの加工方法
WO2013126927A2 (en) * 2012-02-26 2013-08-29 Solexel, Inc. Systems and methods for laser splitting and device layer transfer
KR20260047323A (ko) 2018-03-14 2026-04-07 도쿄엘렉트론가부시키가이샤 기판 가공 장치 및 기판 가공 방법
JP7242362B2 (ja) 2019-03-18 2023-03-20 キオクシア株式会社 半導体装置の製造方法
TWI877184B (zh) 2019-07-18 2025-03-21 日商東京威力科創股份有限公司 處理裝置及處理方法
JP2021068869A (ja) * 2019-10-28 2021-04-30 東京エレクトロン株式会社 基板処理方法及び基板処理システム
JP7386075B2 (ja) 2019-12-25 2023-11-24 東京エレクトロン株式会社 基板処理方法及び基板処理システム
KR20260004590A (ko) * 2019-12-26 2026-01-08 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 장치 및 기판 처리 시스템

Also Published As

Publication number Publication date
JP2025105952A (ja) 2025-07-10
JPWO2023021952A1 (https=) 2023-02-23
KR20240043781A (ko) 2024-04-03
JP7678881B2 (ja) 2025-05-16
WO2023021952A1 (ja) 2023-02-23

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