JPWO2023008227A5 - - Google Patents
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- Publication number
- JPWO2023008227A5 JPWO2023008227A5 JP2023538438A JP2023538438A JPWO2023008227A5 JP WO2023008227 A5 JPWO2023008227 A5 JP WO2023008227A5 JP 2023538438 A JP2023538438 A JP 2023538438A JP 2023538438 A JP2023538438 A JP 2023538438A JP WO2023008227 A5 JPWO2023008227 A5 JP WO2023008227A5
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- insulating layer
- base region
- signal
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 54
- 239000000523 sample Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 description 13
- 230000002950 deficient Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021123029 | 2021-07-28 | ||
| PCT/JP2022/027830 WO2023008227A1 (ja) | 2021-07-28 | 2022-07-15 | プローブカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008227A1 JPWO2023008227A1 (https=) | 2023-02-02 |
| JPWO2023008227A5 true JPWO2023008227A5 (https=) | 2024-04-22 |
Family
ID=85087604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538438A Pending JPWO2023008227A1 (https=) | 2021-07-28 | 2022-07-15 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240329085A1 (https=) |
| JP (1) | JPWO2023008227A1 (https=) |
| TW (1) | TW202319756A (https=) |
| WO (1) | WO2023008227A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI879533B (zh) * | 2024-04-15 | 2025-04-01 | 林靜芬 | 高速探針卡結構 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
| US6965244B2 (en) * | 2002-05-08 | 2005-11-15 | Formfactor, Inc. | High performance probe system |
| JP2004150927A (ja) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | プロービング装置 |
| US8581610B2 (en) * | 2004-04-21 | 2013-11-12 | Charles A Miller | Method of designing an application specific probe card test system |
| US7245134B2 (en) * | 2005-01-31 | 2007-07-17 | Formfactor, Inc. | Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes |
| US7312617B2 (en) * | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
| US8841931B2 (en) * | 2011-01-27 | 2014-09-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe card wiring structure |
| US9244099B2 (en) * | 2011-05-09 | 2016-01-26 | Cascade Microtech, Inc. | Probe head assemblies, components thereof, test systems including the same, and methods of operating the same |
| US9207259B2 (en) * | 2011-06-10 | 2015-12-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe card for probing integrated circuits |
| JP7336176B2 (ja) * | 2017-12-18 | 2023-08-31 | 株式会社ヨコオ | 検査治具 |
| JP2019109101A (ja) * | 2017-12-18 | 2019-07-04 | 株式会社ヨコオ | 検査治具 |
| JP2019109103A (ja) * | 2017-12-18 | 2019-07-04 | 株式会社ヨコオ | 検査治具 |
-
2022
- 2022-07-15 US US18/578,025 patent/US20240329085A1/en not_active Abandoned
- 2022-07-15 JP JP2023538438A patent/JPWO2023008227A1/ja active Pending
- 2022-07-15 WO PCT/JP2022/027830 patent/WO2023008227A1/ja not_active Ceased
- 2022-07-15 TW TW111126712A patent/TW202319756A/zh unknown
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