JPWO2023008227A1 - - Google Patents

Info

Publication number
JPWO2023008227A1
JPWO2023008227A1 JP2023538438A JP2023538438A JPWO2023008227A1 JP WO2023008227 A1 JPWO2023008227 A1 JP WO2023008227A1 JP 2023538438 A JP2023538438 A JP 2023538438A JP 2023538438 A JP2023538438 A JP 2023538438A JP WO2023008227 A1 JPWO2023008227 A1 JP WO2023008227A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023538438A
Other languages
Japanese (ja)
Other versions
JPWO2023008227A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023008227A1 publication Critical patent/JPWO2023008227A1/ja
Publication of JPWO2023008227A5 publication Critical patent/JPWO2023008227A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2023538438A 2021-07-28 2022-07-15 Pending JPWO2023008227A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021123029 2021-07-28
PCT/JP2022/027830 WO2023008227A1 (ja) 2021-07-28 2022-07-15 プローブカード

Publications (2)

Publication Number Publication Date
JPWO2023008227A1 true JPWO2023008227A1 (https=) 2023-02-02
JPWO2023008227A5 JPWO2023008227A5 (https=) 2024-04-22

Family

ID=85087604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538438A Pending JPWO2023008227A1 (https=) 2021-07-28 2022-07-15

Country Status (4)

Country Link
US (1) US20240329085A1 (https=)
JP (1) JPWO2023008227A1 (https=)
TW (1) TW202319756A (https=)
WO (1) WO2023008227A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI879533B (zh) * 2024-04-15 2025-04-01 林靜芬 高速探針卡結構

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
JP2004150927A (ja) * 2002-10-30 2004-05-27 Fujitsu Ltd プロービング装置
US8581610B2 (en) * 2004-04-21 2013-11-12 Charles A Miller Method of designing an application specific probe card test system
US7245134B2 (en) * 2005-01-31 2007-07-17 Formfactor, Inc. Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes
US7312617B2 (en) * 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8841931B2 (en) * 2011-01-27 2014-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card wiring structure
US9244099B2 (en) * 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US9207259B2 (en) * 2011-06-10 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card for probing integrated circuits
JP7336176B2 (ja) * 2017-12-18 2023-08-31 株式会社ヨコオ 検査治具
JP2019109101A (ja) * 2017-12-18 2019-07-04 株式会社ヨコオ 検査治具
JP2019109103A (ja) * 2017-12-18 2019-07-04 株式会社ヨコオ 検査治具

Also Published As

Publication number Publication date
WO2023008227A1 (ja) 2023-02-02
US20240329085A1 (en) 2024-10-03
TW202319756A (zh) 2023-05-16

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231204

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250630