TW202319756A - 探針卡 - Google Patents

探針卡 Download PDF

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Publication number
TW202319756A
TW202319756A TW111126712A TW111126712A TW202319756A TW 202319756 A TW202319756 A TW 202319756A TW 111126712 A TW111126712 A TW 111126712A TW 111126712 A TW111126712 A TW 111126712A TW 202319756 A TW202319756 A TW 202319756A
Authority
TW
Taiwan
Prior art keywords
conductor
transmission
transmission conductor
probe
conductors
Prior art date
Application number
TW111126712A
Other languages
English (en)
Chinese (zh)
Inventor
軣木岳史
Original Assignee
日商友華股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商友華股份有限公司 filed Critical 日商友華股份有限公司
Publication of TW202319756A publication Critical patent/TW202319756A/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW111126712A 2021-07-28 2022-07-15 探針卡 TW202319756A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021123029 2021-07-28
JP2021-123029 2021-07-28

Publications (1)

Publication Number Publication Date
TW202319756A true TW202319756A (zh) 2023-05-16

Family

ID=85087604

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111126712A TW202319756A (zh) 2021-07-28 2022-07-15 探針卡

Country Status (4)

Country Link
US (1) US20240329085A1 (https=)
JP (1) JPWO2023008227A1 (https=)
TW (1) TW202319756A (https=)
WO (1) WO2023008227A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI879533B (zh) * 2024-04-15 2025-04-01 林靜芬 高速探針卡結構

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
JP2004150927A (ja) * 2002-10-30 2004-05-27 Fujitsu Ltd プロービング装置
US8581610B2 (en) * 2004-04-21 2013-11-12 Charles A Miller Method of designing an application specific probe card test system
US7245134B2 (en) * 2005-01-31 2007-07-17 Formfactor, Inc. Probe card assembly including a programmable device to selectively route signals from channels of a test system controller to probes
US7312617B2 (en) * 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8841931B2 (en) * 2011-01-27 2014-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card wiring structure
US9244099B2 (en) * 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
US9207259B2 (en) * 2011-06-10 2015-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Probe card for probing integrated circuits
JP7336176B2 (ja) * 2017-12-18 2023-08-31 株式会社ヨコオ 検査治具
JP2019109101A (ja) * 2017-12-18 2019-07-04 株式会社ヨコオ 検査治具
JP2019109103A (ja) * 2017-12-18 2019-07-04 株式会社ヨコオ 検査治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI879533B (zh) * 2024-04-15 2025-04-01 林靜芬 高速探針卡結構

Also Published As

Publication number Publication date
WO2023008227A1 (ja) 2023-02-02
US20240329085A1 (en) 2024-10-03
JPWO2023008227A1 (https=) 2023-02-02

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