JPWO2023008185A5 - - Google Patents

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Publication number
JPWO2023008185A5
JPWO2023008185A5 JP2023538416A JP2023538416A JPWO2023008185A5 JP WO2023008185 A5 JPWO2023008185 A5 JP WO2023008185A5 JP 2023538416 A JP2023538416 A JP 2023538416A JP 2023538416 A JP2023538416 A JP 2023538416A JP WO2023008185 A5 JPWO2023008185 A5 JP WO2023008185A5
Authority
JP
Japan
Prior art keywords
recesses
solid electrolytic
lead frame
electrolytic capacitor
embedded portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023538416A
Other languages
English (en)
Japanese (ja)
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JPWO2023008185A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/027458 external-priority patent/WO2023008185A1/ja
Publication of JPWO2023008185A1 publication Critical patent/JPWO2023008185A1/ja
Publication of JPWO2023008185A5 publication Critical patent/JPWO2023008185A5/ja
Pending legal-status Critical Current

Links

JP2023538416A 2021-07-29 2022-07-12 Pending JPWO2023008185A1 (https=)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021124385 2021-07-29
JP2021141481 2021-08-31
JP2021141482 2021-08-31
PCT/JP2022/027458 WO2023008185A1 (ja) 2021-07-29 2022-07-12 固体電解コンデンサおよび固体電解コンデンサの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023008185A1 JPWO2023008185A1 (https=) 2023-02-02
JPWO2023008185A5 true JPWO2023008185A5 (https=) 2024-04-22

Family

ID=85086698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538416A Pending JPWO2023008185A1 (https=) 2021-07-29 2022-07-12

Country Status (3)

Country Link
US (1) US20240242891A1 (https=)
JP (1) JPWO2023008185A1 (https=)
WO (1) WO2023008185A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025056499A (ja) * 2023-09-27 2025-04-08 パナソニックＩｐマネジメント株式会社 電解コンデンサ

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6972943B2 (en) * 2002-12-12 2005-12-06 Sanyo Electric Co., Ltd. Electronic component having lead frame
JP2005093591A (ja) * 2003-09-16 2005-04-07 Sanyo Electric Co Ltd 固体電解コンデンサ
JP2006237195A (ja) * 2005-02-24 2006-09-07 Sanyo Electric Co Ltd 固体電解コンデンサ
JP4880431B2 (ja) * 2006-11-27 2012-02-22 ニチコン株式会社 チップ状固体電解コンデンサ
JP4842199B2 (ja) * 2007-04-25 2011-12-21 ニチコン株式会社 固体電解コンデンサ
JP5268763B2 (ja) * 2009-04-22 2013-08-21 三洋電機株式会社 固体電解コンデンサ
US8339771B2 (en) * 2010-02-19 2012-12-25 Avx Corporation Conductive adhesive for use in a solid electrolytic capacitor
US9949378B2 (en) * 2014-04-14 2018-04-17 Presidio Components, Inc. Electrical devices with solder dam
JP2015230976A (ja) * 2014-06-05 2015-12-21 株式会社村田製作所 固体電解コンデンサの製造方法および固体電解コンデンサ
TWI559349B (zh) * 2014-10-28 2016-11-21 鈺邦科技股份有限公司 導電端子改良之固態電解電容器封裝結構之製造方法
CN107135650A (zh) * 2015-01-23 2017-09-05 古河电气工业株式会社 金属构件与树脂模制件的复合体以及用于与树脂模制件形成复合体的金属构件
CN109791845B (zh) * 2016-09-29 2021-08-24 松下知识产权经营株式会社 固体电解电容器
CN111133541A (zh) * 2017-09-29 2020-05-08 松下知识产权经营株式会社 电解电容器
JP2020072186A (ja) * 2018-10-31 2020-05-07 パナソニックＩｐマネジメント株式会社 電解コンデンサ
JP2022049987A (ja) * 2020-09-17 2022-03-30 株式会社村田製作所 積層セラミック電子部品、積層セラミック電子部品の実装構造

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