JPWO2022230637A5 - - Google Patents

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JPWO2022230637A5
JPWO2022230637A5 JP2023517414A JP2023517414A JPWO2022230637A5 JP WO2022230637 A5 JPWO2022230637 A5 JP WO2022230637A5 JP 2023517414 A JP2023517414 A JP 2023517414A JP 2023517414 A JP2023517414 A JP 2023517414A JP WO2022230637 A5 JPWO2022230637 A5 JP WO2022230637A5
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Japan
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sealing
composition
electronic device
meth
chain
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JP2023517414A
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Japanese (ja)
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JP7786457B2 (ja
JPWO2022230637A1 (https=
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Priority claimed from PCT/JP2022/017320 external-priority patent/WO2022230637A1/ja
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JP2023517414A 2021-04-30 2022-04-08 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 Active JP7786457B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021077532 2021-04-30
JP2021077532 2021-04-30
PCT/JP2022/017320 WO2022230637A1 (ja) 2021-04-30 2022-04-08 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Publications (3)

Publication Number Publication Date
JPWO2022230637A1 JPWO2022230637A1 (https=) 2022-11-03
JPWO2022230637A5 true JPWO2022230637A5 (https=) 2024-06-14
JP7786457B2 JP7786457B2 (ja) 2025-12-16

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JP2023517414A Active JP7786457B2 (ja) 2021-04-30 2022-04-08 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Country Status (4)

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JP (1) JP7786457B2 (https=)
KR (1) KR20230145185A (https=)
CN (1) CN117296450A (https=)
WO (1) WO2022230637A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118909553B (zh) * 2024-10-10 2025-02-25 万华化学集团电子材料有限公司 一种光固化膜组合物及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591808U (ja) 1982-06-29 1984-01-07 いすゞ自動車株式会社 エンジンの油圧タペツト
KR101549726B1 (ko) * 2012-12-20 2015-09-02 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치
JP6099198B2 (ja) * 2013-03-29 2017-03-22 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
KR20160053750A (ko) 2014-10-29 2016-05-13 삼성에스디아이 주식회사 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치
CN110024483A (zh) * 2016-12-06 2019-07-16 捷恩智株式会社 油墨组合物及使用其的有机电场发光元件
US12312484B2 (en) * 2018-11-12 2025-05-27 Lg Chem, Ltd. Encapsulating composition
WO2022039019A1 (ja) * 2020-08-19 2022-02-24 コニカミノルタ株式会社 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

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