CN117296450A - 电子器件密封用组合物、电子器件密封膜形成方法以及电子器件密封膜 - Google Patents

电子器件密封用组合物、电子器件密封膜形成方法以及电子器件密封膜 Download PDF

Info

Publication number
CN117296450A
CN117296450A CN202280031667.0A CN202280031667A CN117296450A CN 117296450 A CN117296450 A CN 117296450A CN 202280031667 A CN202280031667 A CN 202280031667A CN 117296450 A CN117296450 A CN 117296450A
Authority
CN
China
Prior art keywords
sealing
electronic device
meth
composition
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280031667.0A
Other languages
English (en)
Chinese (zh)
Inventor
牧岛幸宏
广沢昇太
竹村千代子
森川慎一郎
松本彩花
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Publication of CN117296450A publication Critical patent/CN117296450A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
    • C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/057—Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN202280031667.0A 2021-04-30 2022-04-08 电子器件密封用组合物、电子器件密封膜形成方法以及电子器件密封膜 Pending CN117296450A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-077532 2021-04-30
JP2021077532 2021-04-30
PCT/JP2022/017320 WO2022230637A1 (ja) 2021-04-30 2022-04-08 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Publications (1)

Publication Number Publication Date
CN117296450A true CN117296450A (zh) 2023-12-26

Family

ID=83848100

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280031667.0A Pending CN117296450A (zh) 2021-04-30 2022-04-08 电子器件密封用组合物、电子器件密封膜形成方法以及电子器件密封膜

Country Status (4)

Country Link
JP (1) JP7786457B2 (https=)
KR (1) KR20230145185A (https=)
CN (1) CN117296450A (https=)
WO (1) WO2022230637A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118909553A (zh) * 2024-10-10 2024-11-08 万华化学集团电子材料有限公司 一种光固化膜组合物及其应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591808U (ja) 1982-06-29 1984-01-07 いすゞ自動車株式会社 エンジンの油圧タペツト
KR101549726B1 (ko) * 2012-12-20 2015-09-02 제일모직주식회사 봉지용 조성물, 이를 포함하는 장벽층 및 이를 포함하는 봉지화된 장치
JP6099198B2 (ja) * 2013-03-29 2017-03-22 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
KR20160053750A (ko) 2014-10-29 2016-05-13 삼성에스디아이 주식회사 디스플레이 밀봉재용 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 디스플레이 장치
CN110024483A (zh) * 2016-12-06 2019-07-16 捷恩智株式会社 油墨组合物及使用其的有机电场发光元件
US12312484B2 (en) * 2018-11-12 2025-05-27 Lg Chem, Ltd. Encapsulating composition
WO2022039019A1 (ja) * 2020-08-19 2022-02-24 コニカミノルタ株式会社 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118909553A (zh) * 2024-10-10 2024-11-08 万华化学集团电子材料有限公司 一种光固化膜组合物及其应用

Also Published As

Publication number Publication date
KR20230145185A (ko) 2023-10-17
JP7786457B2 (ja) 2025-12-16
JPWO2022230637A1 (https=) 2022-11-03
WO2022230637A1 (ja) 2022-11-03

Similar Documents

Publication Publication Date Title
JP7203903B2 (ja) 有機エレクトロルミネッセンス表示素子用封止剤
CN116096563B (zh) 电子设备封装用组合物、电子设备封装膜形成方法和电子设备封装膜
US7229703B2 (en) Gas barrier substrate
TWI888345B (zh) 有機電致發光顯示元件用密封劑
JPWO2018051732A1 (ja) インク組成物およびこれを用いた有機電界発光素子
JP2004299230A (ja) ガスバリア性基板
EP3023444A1 (en) Composition for fabricating organic film, organic light-emitting display apparatus manufactured using the same, and method of manufacturing the organic light-emitting display apparatus
WO2018070488A1 (ja) 組成物
TW201441051A (zh) 阻氣性薄膜及其製造方法
JP2015103389A (ja) 有機ｅｌ素子
JP7786457B2 (ja) 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
KR20140004906A (ko) 광경화 조성물 및 상기 조성물로 형성된 보호층을 포함하는 광학 부재
JP7835225B2 (ja) 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
JP2004303562A (ja) 有機エレクトロルミネッセント素子用基板
KR102955051B1 (ko) 전자 디바이스 밀봉용 조성물, 전자 디바이스 밀봉막 및 전자 디바이스 밀봉막의 형성 방법
TWI867642B (zh) 電子裝置密封用組成物、電子裝置密封膜及電子裝置密封膜之形成方法
TWI869953B (zh) 電子裝置密封用組成物、電子裝置密封膜及電子裝置密封膜的形成方法
TWI869951B (zh) 電子裝置密封用組成物、電子裝置密封膜及電子裝置密封膜之形成方法
WO2025094586A1 (ja) インクジェット用の電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜
WO2025126843A1 (ja) インクジェット用の電子デバイス封止用組成物、電子デバイス封止膜及び電子デバイス封止膜形成方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination