JPWO2022202505A5 - - Google Patents
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- Publication number
- JPWO2022202505A5 JPWO2022202505A5 JP2023509054A JP2023509054A JPWO2022202505A5 JP WO2022202505 A5 JPWO2022202505 A5 JP WO2022202505A5 JP 2023509054 A JP2023509054 A JP 2023509054A JP 2023509054 A JP2023509054 A JP 2023509054A JP WO2022202505 A5 JPWO2022202505 A5 JP WO2022202505A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- conductive resin
- composition according
- carbon atoms
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 claims 11
- 239000011342 resin composition Substances 0.000 claims 10
- 239000004593 Epoxy Substances 0.000 claims 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 5
- 125000000962 organic group Chemical group 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 3
- 125000002947 alkylene group Chemical group 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- -1 acrylic compound Chemical class 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000005245 sintering Methods 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 125000002993 cycloalkylene group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021048261 | 2021-03-23 | ||
| JP2021048261 | 2021-03-23 | ||
| JP2021163521 | 2021-10-04 | ||
| JP2021163521 | 2021-10-04 | ||
| PCT/JP2022/011708 WO2022202505A1 (ja) | 2021-03-23 | 2022-03-15 | 導電性樹脂組成物、高熱伝導性材料および半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022202505A1 JPWO2022202505A1 (enrdf_load_stackoverflow) | 2022-09-29 |
| JPWO2022202505A5 true JPWO2022202505A5 (enrdf_load_stackoverflow) | 2023-07-21 |
| JP7491463B2 JP7491463B2 (ja) | 2024-05-28 |
Family
ID=83396138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023509054A Active JP7491463B2 (ja) | 2021-03-23 | 2022-03-15 | 導電性樹脂組成物、高熱伝導性材料および半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7491463B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20230159849A (enrdf_load_stackoverflow) |
| TW (1) | TW202244101A (enrdf_load_stackoverflow) |
| WO (1) | WO2022202505A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7677368B2 (ja) * | 2023-03-20 | 2025-05-15 | 味の素株式会社 | 液状樹脂組成物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
| JP2004168922A (ja) * | 2002-11-21 | 2004-06-17 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
| JP5200340B2 (ja) * | 2006-06-27 | 2013-06-05 | 住友ベークライト株式会社 | 液状樹脂組成物及び液状樹脂組成物を使用して作製した半導体装置 |
| JP6478465B2 (ja) | 2014-02-28 | 2019-03-06 | 昭和電工株式会社 | 導電性接着剤及びそれらを使用した電子機器 |
| JP5806760B1 (ja) | 2014-05-29 | 2015-11-10 | 田中貴金属工業株式会社 | 熱伝導性導電性接着剤組成物 |
| JP6203783B2 (ja) * | 2015-05-29 | 2017-09-27 | 株式会社タムラ製作所 | 導電性接着剤および電子基板の製造方法 |
| DE112018002911T5 (de) | 2017-06-07 | 2020-02-20 | Tanaka Kikinzoku Kogyo K.K. | Thermisch leitende und elektrisch leitende Adhäsivzusammensetzung |
| KR20230048009A (ko) * | 2020-08-04 | 2023-04-10 | 나믹스 가부시끼가이샤 | 도전성 조성물, 다이 어태치재, 가압 소결형 다이 어태치재, 및 전자 부품 |
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2022
- 2022-03-15 JP JP2023509054A patent/JP7491463B2/ja active Active
- 2022-03-15 WO PCT/JP2022/011708 patent/WO2022202505A1/ja active Application Filing
- 2022-03-15 KR KR1020237035594A patent/KR20230159849A/ko active Pending
- 2022-03-18 TW TW111110085A patent/TW202244101A/zh unknown